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MKW01Z128CHNR

NXP Semiconductors

MKW01Z128CHNR by NXP Semiconductors

MICROPROCESSOR CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,711 parts In-Stock

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Anansix

USA . 2,234 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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Digiode

USA . 1,002 parts In-Stock

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1,002

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Distributors (Availability)

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AZTECH Wire

Italy . 1,020 parts In-Stock

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$12.380

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$12.380

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One Stop Electronics

USA . 1,036 parts In-Stock

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$16.000

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$54.498

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$49.593

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$44.688

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5,000

$54.498

$49.593

$44.688

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Corohmni

South Africa . 650 parts In-Stock

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$83.987

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650

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UNI Independent Distributors

Spain . 5,510 parts In-Stock

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Corphita

USA . 2,337 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs MKW01Z128CHNR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL GOLD

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MKW01Z128CHNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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