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DRA780BDGABFQ1

Texas Instruments

DRA780BDGABFQ1 by Texas Instruments

The Texas Instruments DRA780BDGABFQ1 is an automotive-grade microprocessor circuit with 367 terminals in a grid array package. It operates at a max clock frequency of 32 MHz and supports CAN, I2C, SPI, and UART bus compatibility. Ideal for automotive applications requiring high performance and reliability in extreme temperatures (-40 to 125 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,950 parts In-Stock

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2,950

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Digiode

USA . 633 parts In-Stock

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633

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Distributors (Availability)

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Native Components

USA . 79 parts In-Stock

1+ parts

$2.035

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-

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79

$2.035

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Northwest PG Solutions

USA . 884 parts In-Stock

1+ parts

$2.239

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884

$2.239

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AZTECH Wire

Italy . 216 parts In-Stock

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$6.569

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216

$6.569

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Parana Technologies

USA . 2,185 parts In-Stock

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$21.692

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$22.120

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2,185

$21.692

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$22.120

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One Stop Electronics

USA . 787 parts In-Stock

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$22.000

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787

$22.000

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DigiPath Technology Company

USA . 1,736 parts In-Stock

1+ parts

$23.886

100+ parts

$21.975

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1,736

$23.886

$21.975

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ChromeModa Solutions

Germany . 2,252 parts In-Stock

1+ parts

$24.373

100+ parts

$19.986

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2,252

$24.373

$19.986

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IDEA Electronic Components Group

UK . 1,812 parts In-Stock

1+ parts

$24.373

100+ parts

$23.154

1k+ parts

$21.936

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1,812

$24.373

$23.154

$21.936

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Corohmni

South Africa . 3,204 parts In-Stock

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$54.113

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3,204

$54.113

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Corphita

USA . 1,918 parts In-Stock

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1,918

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Microchip USA

USA . 1,133 parts In-Stock

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Overview

Experience the next level of performance and reliability with the DRA780BDGABFQ1 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and cutting-edge technology in all their products. This versatile microprocessor circuit is designed for automotive applications, offering unparalleled efficiency and functionality. With a wide range of bus compatibility and a robust package body material, this product delivers exceptional value and benefits to customers seeking high-performance solutions. Trust Texas Instruments to provide you with the best in class ICs for your automotive needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the product on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.11 V

The high maximum supply voltage allows for the product to operate reliably under varying power conditions, increasing its versatility.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the product meets rigorous automotive industry standards, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, optimizing the design layout and saving valuable board space.

No. of Terminals: 367

The high number of terminals provides ample connectivity options and flexibility for integrating the product into various electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced thermal performance and mechanical stability, making it suitable for demanding applications.

Minimum Supply Voltage: 1.02 V

The low minimum supply voltage ensures that the product can operate efficiently even under low power conditions, making it energy-efficient.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for the product to withstand harsh environmental conditions, ensuring reliable performance in extreme temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function effectively in cold environments, adding to its versatility.

Terminal Finish: TIN SILVER COPPER

The triple-layer terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the product into electronic systems.

Maximum Seated Height: 2.82 mm

The low maximum seated height allows for compact and slim designs, saving space and facilitating the design of thinner electronic devices.

Width: 15 mm

The moderate width of the product makes it suitable for various PCB sizes and layouts, offering flexibility in design configurations.

External Data Bus Width: 48

The wide external data bus width allows for high-speed data transfer and processing, enhancing the product's performance capabilities.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast and efficient operation of the product, making it ideal for applications requiring high processing speeds.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature allows for thorough and reliable soldering during assembly, ensuring robust connections.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance ensures that the product can withstand the heat of the soldering process, preventing damage during assembly.

Length: 15 mm

The moderate length of the product allows for flexibility in PCB layout and design, accommodating various form factors and device configurations.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification indicates that the product can operate reliably in automotive environments, making it suitable for automotive applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC enhances the product's processing capabilities, allowing for complex functions and tasks to be executed efficiently.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and solder joints, ensuring stable signal transmission and functionality.

Nominal Supply Voltage: 1.06 V

The nominal supply voltage provides a balanced operating range for the product, ensuring stable and efficient performance under typical operating conditions.

Bus Compatibility: CAN; I2C; SPI; UART

The multiple bus compatibility options allow for seamless integration with various communication protocols, expanding the product's compatibility with different systems.

Terminal Pitch: 0.65 mm

The fine terminal pitch enables dense packing and miniaturization of the product, saving space on the PCB and enabling compact device designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has a moderate level of moisture sensitivity during storage and handling, ensuring product reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA780BDGABFQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

CAN; I2C; SPI; UART

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

48

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DRA780BDGABFQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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