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TCI6636K2HDXAAW2

Texas Instruments

TCI6636K2HDXAAW2 by Texas Instruments

TCI6636K2HDXAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a compact square shape measuring 40mm x 40mm, this IC offers efficient processing power in a small footprint design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,378 parts In-Stock

1+ parts

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6,378

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Digiode

USA . 3,180 parts In-Stock

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3,180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 530 parts In-Stock

1+ parts

$9.068

100+ parts

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530

$9.068

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One Stop Electronics

USA . 1,613 parts In-Stock

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$27.000

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1,613

$27.000

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Parana Technologies

USA . 1,615 parts In-Stock

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$50.990

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1,615

$50.990

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IDEA Electronic Components Group

UK . 1,925 parts In-Stock

1+ parts

$57.292

100+ parts

$54.427

1k+ parts

$51.563

10k+ parts

-

1,925

$57.292

$54.427

$51.563

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ChromeModa Solutions

Germany . 359 parts In-Stock

1+ parts

$57.292

100+ parts

$46.979

1k+ parts

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10k+ parts

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359

$57.292

$46.979

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Corohmni

South Africa . 1,090 parts In-Stock

1+ parts

$59.734

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1,090

$59.734

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Corphita

USA . 3,384 parts In-Stock

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3,384

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DigiPath Technology Company

USA . 535 parts In-Stock

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$51.654

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535

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$51.654

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Overview

Unleash the power of cutting-edge technology with the TCI6636K2HDXAAW2 by Texas Instruments. As a top-tier manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. This versatile microprocessor circuit opens up a world of possibilities for various applications. Whether you're looking to enhance your system performance or streamline your operations, this product offers unmatched value and benefits. Trust Texas Instruments to provide superior solutions that meet your needs and exceed your expectations. Upgrade to the TCI6636K2HDXAAW2 today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 1.05 V

Provides sufficient power for the operations of the product without risking damage.

No. of Terminals: 1517

Offers a wide range of connectivity options for various external devices and components.

Package Style (Meter): GRID ARRAY

Enables efficient layout and organization of the terminals for improved functionality.

Width: 40 mm

Compact size allows for flexibility in applications with limited space.

Technology: CMOS

Utilizes low power consumption and is suitable for battery-operated devices.

Moisture Sensitivity Level (MSL): 4

Withstands moderate exposure to moisture, making it suitable for various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6636K2HDXAAW2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6636K2HDXAAW2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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