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TCI6636K2HDXAAW24

Texas Instruments

TCI6636K2HDXAAW24 by Texas Instruments

TCI6636K2HDXAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it suitable for high-performance computing applications. The PLASTIC/EPOXY material and BALL terminal form ensure reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,238 parts In-Stock

1+ parts

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4,238

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Digiode

USA . 2,930 parts In-Stock

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2,930

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$9.300

100+ parts

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218

$9.300

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One Stop Electronics

USA . 863 parts In-Stock

1+ parts

$24.000

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863

$24.000

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Parana Technologies

USA . 1,481 parts In-Stock

1+ parts

$35.361

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1,481

$35.361

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ChromeModa Solutions

Germany . 6,500 parts In-Stock

1+ parts

$39.732

100+ parts

$32.580

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6,500

$39.732

$32.580

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

1+ parts

$39.732

100+ parts

$37.745

1k+ parts

$35.759

10k+ parts

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1,745

$39.732

$37.745

$35.759

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Corohmni

South Africa . 867 parts In-Stock

1+ parts

$74.875

100+ parts

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867

$74.875

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DigiPath Technology Company

USA . 2,311 parts In-Stock

1+ parts

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100+ parts

$35.822

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2,311

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$35.822

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Corphita

USA . 2,007 parts In-Stock

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2,007

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Overview

Unleash the power of cutting-edge technology with the TCI6636K2HDXAAW24 by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This innovative product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering endless possibilities for various applications. Experience seamless performance and unmatched efficiency with this advanced microprocessor circuit. Elevate your projects to new heights with the TCI6636K2HDXAAW24, providing unbeatable value and unparalleled benefits to customers seeking excellence in their work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making the product easy to integrate into electronic circuits.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power input, accommodating different power sources.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of handling during assembly and installation.

No. of Terminals: 1517

The high number of terminals enables complex circuit connections and functionality, making the product versatile.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and reliability, making it suitable for high-performance applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections.

Terminal Position: BOTTOM

The bottom terminal position assists in heat dissipation and thermal management, enhancing the product's performance and reliability.

Maximum Seated Height: 3.75 mm

The low seated height enables compact and slim device designs, ideal for applications where space is limited.

Width: 40 mm

The moderate width provides a balance between compactness and ease of handling, facilitating installation and integration.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes thermal stress on components during assembly, ensuring quality and reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for proper soldering and bonding, ensuring stable and durable connections.

Length: 40 mm

The moderate length offers a good balance between compactness and functionality, accommodating various circuit layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit provides advanced processing capabilities, enabling the product to perform complex functions efficiently.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form allows for reliable connections and ease of soldering, ensuring stable electrical performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage provides a standard reference for power input, ensuring compatibility with common power sources.

Terminal Pitch: 1 mm

The small terminal pitch enables high-density packaging and routing of signal connections, optimizing circuit layout.

Moisture Sensitivity Level (MSL): 4

The low moisture sensitivity level indicates good resistance to moisture and humidity, enhancing the product's durability and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6636K2HDXAAW24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6636K2HDXAAW24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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