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900 Other Function uPs,uCs & Peripheral ICs 117

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z045-1FFG900C by Xilinx

XC7Z045-1FFG900C

Xilinx

XC7Z045-1FFG900C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 900 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.

S-PBGA-B900

27 mm

900

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FFG900I by Xilinx

XC7Z045-1FFG900I

Xilinx

XC7Z045-1FFG900I by Xilinx is a System on Chip with 900 terminals, operating b/w -40 to 100°C. It features a supply voltage range of 0.95V to 1.05V and utilizes CMOS technology. Ideal for applications requiring high-performance processing in compact spaces, such as IoT devices and embedded systems.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG900E by Xilinx

XC7Z045-2FFG900E

Xilinx

The Xilinx XC7Z045-2FFG900E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 900 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG900I by Xilinx

XC7Z045-2FFG900I

Xilinx

The Xilinx XC7Z045-2FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-3FFG900E by Xilinx

XC7Z045-3FFG900E

Xilinx

The Xilinx XC7Z045-3FFG900E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-1FFG900I by Xilinx

XC7Z100-1FFG900I

Xilinx

The Xilinx XC7Z100-1FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-2FFG900I by Xilinx

XC7Z100-2FFG900I

Xilinx

XC7Z100-2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

TCI6630K2LCMSA2 by Texas Instruments

TCI6630K2LCMSA2

Texas Instruments

TCI6630K2LCMSA2 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and can withstand peak reflow temperature of 245°C for up to 30s. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LCMS by Texas Instruments

TCI6630K2LCMS

Texas Instruments

TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA2 by Texas Instruments

TCI6630K2LDCMSA2

Texas Instruments

TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA by Texas Instruments

TCI6630K2LDCMSA

Texas Instruments

Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA2 by Texas Instruments

TCI6630K2LSCMSA2

Texas Instruments

TCI6630K2LSCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, suitable for surface mount applications. Operating b/w 0.902V to 0.997V, it offers high performance in various electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA by Texas Instruments

TCI6630K2LSCMSA

Texas Instruments

TCI6630K2LSCMSA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS2 by Texas Instruments

TCI6630K2LXCMS2

Texas Instruments

TCI6630K2LXCMS2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates on a supply voltage range of 0.902V to 0.997V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a peak reflow temperature of 245°C, this device offers reliable performance in demanding environments.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA2 by Texas Instruments

TCI6630K2LXCMSA2

Texas Instruments

Texas Instruments TCI6630K2LXCMSA2 is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages b/w 0.902V to 0.997V, utilizing CMOS technology. Ideal for applications requiring high-performance computing in compact form factors.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA by Texas Instruments

TCI6630K2LXCMSA

Texas Instruments

TCI6630K2LXCMSA by Texas Instruments is a microprocessor circuit with a max supply voltage of 0.997V and a min supply voltage of 0.902V. It is used in applications requiring high-performance processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS by Texas Instruments

TCI6630K2LXCMS

Texas Instruments

TCI6630K2LXCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XC7Z035-1FFG900C by Xilinx

XC7Z035-1FFG900C

Xilinx

XC7Z035-1FFG900C by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 85 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-1FFG900I by Xilinx

XC7Z035-1FFG900I

Xilinx

XC7Z035-1FFG900I by Xilinx is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FFG900E by Xilinx

XC7Z035-2FFG900E

Xilinx

XC7Z035-2FFG900E by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for various applications in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B900

31 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FFG900I by Xilinx

XC7Z035-2FFG900I

Xilinx

The Xilinx XC7Z035-2FFG900I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-3FFG900E by Xilinx

XC7Z035-3FFG900E

Xilinx

XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B900

31 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-L2FFG900I by Xilinx

XC7Z035-L2FFG900I

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z045-L2FFG900I by Xilinx

XC7Z045-L2FFG900I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-L2FFG900I by Xilinx

XC7Z100-L2FFG900I

Xilinx

XC7Z100-L2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

66AK2L06XCMS2 by Texas Instruments

66AK2L06XCMS2

Texas Instruments

The Texas Instruments 66AK2L06XCMS2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.1V. Ideal for applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA2 by Texas Instruments

66AK2L06XCMSA2

Texas Instruments

The Texas Instruments 66AK2L06XCMSA2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.1V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA by Texas Instruments

66AK2L06XCMSA

Texas Instruments

The Texas Instruments 66AK2L06XCMSA is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.1V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS by Texas Instruments

66AK2L06XCMS

Texas Instruments

The Texas Instruments 66AK2L06XCMS is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.95-1.1 V. This IC, in GRID ARRAY package style, is ideal for applications requiring high processing power in compact designs.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

XCZU9EG-1FFVC900E by Xilinx

XCZU9EG-1FFVC900E

Xilinx

XCZU9EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it requires a supply voltage of 0.825-0.876 V. Ideal for applications requiring high-performance processing capabilities.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-1FFVC900E by Xilinx

XCZU15EG-1FFVC900E

Xilinx

XCZU15EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-1FFVC900I by Xilinx

XCZU15EG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-2FFVC900I by Xilinx

XCZU15EG-2FFVC900I

Xilinx

XCZU15EG-2FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance and reliability.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-L1FFVC900I by Xilinx

XCZU15EG-L1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1FBVB900E by Xilinx

XCZU4CG-1FBVB900E

Xilinx

XCZU4CG-1FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. With a supply voltage range of 0.825-0.876 V, it's ideal for applications requiring high-performance processing capabilities in various electronic devices.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1FBVB900I by Xilinx

XCZU4CG-1FBVB900I

Xilinx

XCZU4CG-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-2FBVB900I by Xilinx

XCZU4CG-2FBVB900I

Xilinx

XCZU4CG-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-L1FBVB900I by Xilinx

XCZU4CG-L1FBVB900I

Xilinx

XCZU4CG-L1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.698V to 0.742V.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-L2FBVB900E by Xilinx

XCZU4CG-L2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-1FBVB900E by Xilinx

XCZU4EG-1FBVB900E

Xilinx

XCZU4EG-1FBVB900E by Xilinx is a CMOS microprocessor circuit with 900 terminals in a rectangular grid array package. It operates at temperatures ranging from 0 to 100°C and has a supply voltage of 0.825 to 0.876V. This IC is commonly used in various applications requiring high-performance processing capabilities.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-1FBVB900I by Xilinx

XCZU4EG-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-2FBVB900I by Xilinx

XCZU4EG-2FBVB900I

Xilinx

XCZU4EG-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-L1FBVB900I by Xilinx

XCZU4EG-L1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-L2FBVB900E by Xilinx

XCZU4EG-L2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-1FBVB900E by Xilinx

XCZU4EV-1FBVB900E

Xilinx

XCZU4EV-1FBVB900E by Xilinx is a CMOS microprocessor circuit with 900 terminals in a rectangular grid array package. It operates at temperatures ranging from 0 to 100 °C and has a supply voltage of 0.825 V to 0.876 V. This IC is commonly used in various applications requiring high-performance processing capabilities.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-1FBVB900I by Xilinx

XCZU4EV-1FBVB900I

Xilinx

XCZU4EV-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it requires a supply voltage of 0.825V to 0.876V.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-2FBVB900I by Xilinx

XCZU4EV-2FBVB900I

Xilinx

XCZU4EV-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package. Suitable for industrial use, it requires a supply voltage of 0.825V to 0.876V and can withstand peak reflow temperature of 245C.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-3FBVB900E by Xilinx

XCZU4EV-3FBVB900E

Xilinx

Xilinx XCZU4EV-3FBVB900E is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.873-0.927 V. Ideal for applications requiring high-performance computing in compact form factors.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT