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XCZU4EG-2FBVB900I

Xilinx

XCZU4EG-2FBVB900I by Xilinx

XCZU4EG-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$2,358.870

Lifecycle Status

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Nova Conductors

Japan . 23 parts In-Stock

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Ampacity Inc.

Singapore . 1,080 parts In-Stock

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One Stop Electronics

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AZTECH Wire

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MARBEL Systems

Belgium . 140 parts In-Stock

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Texas Native Microelectronics

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Semicontronic

India . 483 parts In-Stock

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Kenton Components

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Corohmni

South Africa . 14 parts In-Stock

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Qasali Group International

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Modulus Dynamics

Lithuania . 1,105 parts In-Stock

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A-Z Elektronik GmbH

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Netroflash

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$2,193.749

Overview

Unlock the potential of your project with the XCZU4EG-2FBVB900I by Xilinx. Known for their top-quality products, Xilinx delivers cutting-edge solutions in the category of Other Function uPs, uCs & Peripheral ICs. This versatile microprocessor circuit offers exceptional value and benefits to customers across various industries. Whether you're looking to optimize performance, enhance functionality, or streamline operations, this industrial-grade IC is the perfect choice. Elevate your designs with Xilinx and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and protection for the integrated circuits inside, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 0.876 V

High maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in application.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space on the PCB, allowing for compact and space-saving designs.

No. of Terminals: 900

Large number of terminals provide extensive connectivity options, allowing for versatile and complex circuit designs.

Package Style (Meter): GRID ARRAY

Grid array package style offers high terminal density and improved thermal performance, enhancing overall reliability and functionality.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without compromising performance.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal finish combination offers good conductivity and corrosion resistance, enhancing the overall reliability and lifespan of the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of microprocessor circuit enables advanced processing capabilities and programmability, making the product suitable for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, leading to efficient and reliable performance.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent and reliable operation of the integrated circuits, contributing to overall system stability.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates a low level of moisture sensitivity, allowing for easier storage and handling during manufacturing and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EG-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EG-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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