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MT9V126IA3XTC-DP1

Onsemi

MT9V126IA3XTC-DP1 by Onsemi

Onsemi's MT9V126IA3XTC-DP1 image sensor features 5.60x5.60 um pixel size, 27 MHz master clock, and 74.6 dB dynamic range. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high resolution and versatile output interface.

Median Price

$28.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 105 parts In-Stock

1+ parts

-

100+ parts

$28.710

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$28.710

10k+ parts

$28.710

105

-

$28.710

$28.710

$28.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,554 parts In-Stock

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6,554

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Digiode

USA . 683 parts In-Stock

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683

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Flip Electronics

USA . 105 parts In-Stock

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105

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 442 parts In-Stock

1+ parts

$28.710

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442

$28.710

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TANS Electronics

Latvia . 7,126 parts In-Stock

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7,126

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Problanco Electronics

Mexico . 5,684 parts In-Stock

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5,684

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Kulean Microsystems

USA . 1,671 parts In-Stock

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UHIMA Technologies

Türkiye . 812 parts In-Stock

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812

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Corphita

USA . 283 parts In-Stock

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SupplyDigital Components

Austria . 95 parts In-Stock

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Overview

Capture every moment with the MT9V126IA3XTC-DP1 Image Sensor by Onsemi. Known for their cutting-edge technology and superior quality, Onsemi delivers top-of-the-line products that exceed expectations. The MT9V126IA3XTC-DP1 is perfect for a wide range of applications, providing crisp and clear images with its advanced features. Experience the value and benefits of this innovative product, offering customers unmatched performance and reliability. Upgrade your imaging capabilities with the MT9V126IA3XTC-DP1 Image Sensor today.

Feature Benefit Bullets

Pixel Size (um) 5.60X5.60

Larger pixel size allows for better light sensitivity, resulting in higher image quality and improved low-light performance.

Maximum Supply Voltage 1.9 V

Allows for efficient power usage and compatibility with a wide range of power sources.

Master Clock 27 MHz

High master clock frequency enables fast data processing and high frame rates for smooth image capture.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption, making the product energy efficient.

Package Shape or Style SQUARE

Square package design simplifies mounting and integration into various devices.

Dynamic Range 74.6 dB

Wide dynamic range allows for capturing both bright and dark areas in an image accurately, enhancing image detail and contrast.

Output Interface Type 2-WIRE INTERFACE

2-wire interface simplifies connectivity and integration with other electronics, making the product user-friendly.

Frame Rate 30 fps

High frame rate ensures smooth and fluid video capture, making the product suitable for applications requiring fast motion recording.

Technical Specifications

Image Sensors MT9V126IA3XTC-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.66-2.94 V AND SUPPLY CURRENT 50MA

Array Type:

FRAME

Body Width:

9 inch

Body Length/Diameter:

9 mm

Dynamic Range:

74.6 dB

Frame Rate:

30 fps

Horizontal Pixel:

680

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.60X5.60

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

512

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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