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KAI-47051-AXA-JD-B2

Onsemi

KAI-47051-AXA-JD-B2 by Onsemi

KAI-47051-AXA-JD-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 15.5V max supply voltage. Ideal for applications requiring high-resolution imaging with a dynamic range of 66 dB, such as industrial machine vision systems or scientific cameras.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,520 parts In-Stock

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Digiode

USA . 1,357 parts In-Stock

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AZTECH Wire

Italy . 691 parts In-Stock

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$19.260

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SupplyDigital Components

Austria . 4,631 parts In-Stock

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Problanco Electronics

Mexico . 3,672 parts In-Stock

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Kulean Microsystems

USA . 2,833 parts In-Stock

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Corphita

USA . 1,188 parts In-Stock

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UHIMA Technologies

Türkiye . 929 parts In-Stock

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TANS Electronics

Latvia . 537 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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Overview

Experience crystal-clear image quality like never before with the KAI-47051-AXA-JD-B2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-of-the-line image sensors that are perfect for a wide range of applications. From security cameras to medical imaging devices, this CCD image sensor offers unmatched performance and reliability. Upgrade your technology with the KAI-47051-AXA-JD-B2 and witness the exceptional value it brings to your projects.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 15.5 V

High maximum supply voltage ensures stable operation and performance.

Master Clock: 40 MHz

Fast master clock enables quick data processing and image capture.

Body Width: 44.55 inch

Compact body width allows for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality imaging and low noise performance.

Body Height: 3.25 mm

Low body height is ideal for applications with space constraints.

Package Shape or Style: RECTANGULAR

Rectangular package shape is common and easy to mount in different configurations.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in energy efficiency and reduces heat generation.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Horizontal Pixel: 8856

High horizontal pixel count results in detailed and sharp images.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature allows for use in extreme cold environments.

Dynamic Range: 66 dB

Good dynamic range captures a wide range of light intensities for better image quality.

Vertical Pixel: 5280

High vertical pixel count enhances the image's resolution and clarity.

Body Length/Diameter: 69.96 mm

Moderate body length/diameter provides a balance between compactness and functionality.

Termination Type: SOLDER

Solder termination allows for secure and reliable connections in electronic circuits.

Frame Rate: 7 fps

Decent frame rate is suitable for applications where motion capture is not a priority.

Array Type: INTERLINE

Interline array type is efficient in capturing images with reduced blooming and better color accuracy.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature offers stability and durability in various mounting configurations.

Technical Specifications

Image Sensors KAI-47051-AXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

44.55 inch

Body Height:

3.25 mm

Body Length/Diameter:

69.96 mm

Dynamic Range:

66 dB

Frame Rate:

7 fps

Horizontal Pixel:

8856

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5280

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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