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KAI-08051-FBA-JD-BA

Onsemi

KAI-08051-FBA-JD-BA by Onsemi

KAI-08051-FBA-JD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 15.5 V max supply voltage, and 3364 horizontal pixels. It is ideal for applications requiring a dynamic range of 66 dB, such as industrial machine vision systems or surveillance cameras.

Median Price

$964.845

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

$857.640

100+ parts

$806.180

1k+ parts

$754.720

10k+ parts

-

19

$857.640

$806.180

$754.720

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Verical

USA . 19 parts In-Stock

1+ parts

$1,072.050

100+ parts

$1,007.725

1k+ parts

$943.400

10k+ parts

-

19

$1,072.050

$1,007.725

$943.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,046 parts In-Stock

1+ parts

$948.394

100+ parts

-

1k+ parts

-

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2,046

$948.394

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Vyrian

USA . 8,421 parts In-Stock

1+ parts

-

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-

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8,421

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 366 parts In-Stock

1+ parts

$17.140

100+ parts

-

1k+ parts

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366

$17.140

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-

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Continental Prestige Electronics

USA . 19 parts In-Stock

1+ parts

$847.400

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-

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19

$847.400

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Corphita

USA . 422 parts In-Stock

1+ parts

$898.479

100+ parts

-

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422

$898.479

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-

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Corohmni

South Africa . 461 parts In-Stock

1+ parts

$998.310

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-

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461

$998.310

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TANS Electronics

Latvia . 7,236 parts In-Stock

1+ parts

-

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7,236

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Problanco Electronics

Mexico . 7,203 parts In-Stock

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7,203

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Kulean Microsystems

USA . 6,230 parts In-Stock

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6,230

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SupplyDigital Components

Austria . 4,686 parts In-Stock

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4,686

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UHIMA Technologies

Türkiye . 485 parts In-Stock

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485

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Overview

Elevate your imaging capabilities with the KAI-08051-FBA-JD-BA by Onsemi. Crafted with precision and expertise, this image sensor offers unparalleled quality and performance in a compact package. From capturing stunning visuals to enhancing security systems, this sensor is versatile and reliable for various applications. Experience the convenience of seamless integration and top-notch results with the KAI-08051-FBA-JD-BA. Trust in Onsemi to deliver excellence in every pixel.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Higher pixel size allows for capturing more light, resulting in better image quality with improved low-light performance.

Maximum Supply Voltage: 15.5 V

A higher maximum supply voltage provides flexibility and stability in power input, ensuring optimal performance and reliability.

Body Width: 29 inch

The compact body width of 29 inches makes the sensor suitable for various applications where space may be a constraint.

Power Supplies (V): 15

Standard power supply voltage of 15V makes it compatible with most systems and easy to integrate.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Using CCD sensors ensures high-quality image capture with accurate color reproduction and low noise levels.

Package Shape or Style: RECTANGULAR

Rectangular package shape makes it easier for mounting and integration into different devices or systems.

Minimum Supply Voltage: 14.5 V

With a low minimum supply voltage requirement, the sensor can operate efficiently even in systems with lower power supply capabilities.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for usage in a wide range of environments without compromising performance.

Horizontal Pixel: 3364

High horizontal pixel count provides detailed and sharp images, suitable for applications requiring high-resolution imaging.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures the sensor can function even in extreme cold conditions, making it versatile for various environments.

Dynamic Range: 66 dB

A wide dynamic range helps capture details in both bright and dark areas of the image, producing high-quality and balanced results.

Vertical Pixel: 2520

The high vertical pixel count contributes to better image clarity and sharpness, especially in vertical orientation shots.

Body Length/Diameter: 40 mm

The compact body length of 40mm makes the sensor easy to incorporate into devices with limited space availability.

Optical Format (inch): 4/3

The 4/3 optical format provides a standard aspect ratio, suitable for a wide range of imaging applications with minimal distortion.

Termination Type: SOLDER

Solder termination allows for a reliable and secure connection, ensuring stable performance and durability in various operating conditions.

Array Type: INTERLINE

Interline array type offers fast readout speeds and efficient data transfer, making it suitable for applications requiring rapid image capture and processing.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mount design provides secure and stable attachment options, making it suitable for applications where vibration or movement may be a concern.

Technical Specifications

Image Sensors KAI-08051-FBA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29 inch

Body Length/Diameter:

40 mm

Dynamic Range:

66 dB

Horizontal Pixel:

3364

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2520

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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