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KAI-01150-FBA-FD-BA

Onsemi

KAI-01150-FBA-FD-BA by Onsemi

KAI-01150-FBA-FD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1280x720 resolution, and 64 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.

Median Price

$113.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

1+ parts

$112.100

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7

$112.100

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Verical

USA . 7 parts In-Stock

1+ parts

$112.100

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7

$112.100

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Chip1Stop

Japan . 7 parts In-Stock

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$114.000

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7

$114.000

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Rochester

USA . 3 parts In-Stock

1+ parts

$182.300

100+ parts

$171.360

1k+ parts

$154.950

10k+ parts

$154.950

3

$182.300

$171.360

$154.950

$154.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 240 parts In-Stock

1+ parts

$106.495

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240

$106.495

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Vyrian

USA . 2,647 parts In-Stock

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2,647

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Distributors (Availability)

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AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$14.410

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469

$14.410

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Corphita

USA . 2,469 parts In-Stock

1+ parts

$100.890

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2,469

$100.890

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Corohmni

South Africa . 118 parts In-Stock

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$112.100

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118

$112.100

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$147.370

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3

$147.370

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SupplyDigital Components

Austria . 4,777 parts In-Stock

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4,777

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Kulean Microsystems

USA . 3,555 parts In-Stock

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3,555

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TANS Electronics

Latvia . 2,390 parts In-Stock

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2,390

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Problanco Electronics

Mexico . 1,620 parts In-Stock

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UHIMA Technologies

Türkiye . 443 parts In-Stock

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443

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Overview

Elevate your imaging with the KAI-01150-FBA-FD-BA by Onsemi. This cutting-edge image sensor offers unparalleled quality and performance, backed by the renowned manufacturer Onsemi. Ideal for a wide range of applications, this sensor delivers exceptional clarity and precision in every shot. Unlock a world of possibilities with the KAI-01150-FBA-FD-BA and experience the value and benefits it brings to your projects. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for higher resolution and increased image detail.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility and compatibility with different power sources.

Body Width: 18.29 inch

Compact body width allows for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors provide high-quality image output with low noise levels.

Body Height: 2.94 mm

Low-profile body height enables the sensor to be used in slim devices or applications.

Package Shape or Style: SQUARE

Square package design makes it easier to mount and align the sensor accurately.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage ensures efficient power consumption and extends battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in varying environmental conditions.

Horizontal Pixel: 1280

Higher horizontal pixel count results in sharper and more detailed images.

Minimum Operating Temperature: -50 °C

The ability to operate in extremely low temperatures makes it suitable for a wide range of applications.

Housing: CERAMIC

Ceramic housing offers excellent protection and durability for the sensor.

Dynamic Range: 64 dB

Wide dynamic range ensures accurate representation of both bright and dark areas in an image.

Vertical Pixel: 720

The vertical pixel count complements the horizontal pixels for balanced image resolution.

Body Length/Diameter: 18.29 mm

Compact body length or diameter allows for versatile placement and integration within devices.

Optical Format (inch): 1/2

Suitable optical format for capturing high-quality images with a good depth of field.

Termination Type: SOLDER

Solder termination ensures secure and reliable connection to the device's circuitry.

Array Type: INTERLINE

Interline array type offers high sensitivity and fast readout for efficient image capture.

Mounting Feature: SURFACE MOUNT

Surface mount capability makes installation and assembly of the sensor quick and convenient.

Technical Specifications

Image Sensors KAI-01150-FBA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

18.29 inch

Body Height:

2.94 mm

Body Length/Diameter:

18.29 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1280

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/2

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

720

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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