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AR0141CS2C00SUEA0-DP

Onsemi

AR0141CS2C00SUEA0-DP by Onsemi

AR0141CS2C00SUEA0-DP by Onsemi is an image sensor with 1280x800 resolution, 3x3 um pixel size, and 79 dB dynamic range. Ideal for applications requiring high-quality digital imaging such as surveillance cameras, automotive vision systems, and industrial machine vision.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 5,811 parts In-Stock

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Vyrian

USA . 11,197 parts In-Stock

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Flip Electronics

USA . 5,811 parts In-Stock

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Digiode

USA . 1,585 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 895 parts In-Stock

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$0.085

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$0.082

895

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$0.082

Northwest PG Solutions

USA . 1,301 parts In-Stock

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$0.094

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AZTECH Wire

Italy . 615 parts In-Stock

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$8.020

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Perfect Parts

USA . 20,580 parts In-Stock

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SupplyDigital Components

Austria . 8,008 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 4,316 parts In-Stock

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Problanco Electronics

Mexico . 4,315 parts In-Stock

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Kepictronics

USA . 3,095 parts In-Stock

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Kulean Microsystems

USA . 3,055 parts In-Stock

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GreenTree Electronics

Israel . 2,595 parts In-Stock

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Corphita

USA . 1,879 parts In-Stock

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UHIMA Technologies

Türkiye . 943 parts In-Stock

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Corohmni

South Africa . 330 parts In-Stock

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Overview

Elevate your imaging experience with the AR0141CS2C00SUEA0-DP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in their image sensors. Perfect for a wide range of applications, this sensor boasts a high pixel count and impressive dynamic range. With a compact design and easy installation, the AR0141CS2C00SUEA0-DP offers exceptional value and performance to meet all your imaging needs. Upgrade your imaging capabilities today with this top-of-the-line sensor from Onsemi.

Feature Benefit Bullets

Pixel Size (um): 3X3

Small pixel size allows for high resolution imaging and better detail in captured images.

Maximum Supply Voltage: 1.95 V

Higher supply voltage ensures stable and reliable performance of the image sensor.

Master Clock: 50 MHz

High master clock frequency enables fast data processing and image capturing capabilities.

Body Width: 9 inch

Compact body width ensures easy integration and installation in various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology provides high quality image capture and low power consumption.

Body Height: 1.4 mm

Low body height facilitates slim design and integration in thin electronic devices.

Package Shape or Style: SQUARE

Square package shape provides efficient use of space and easy alignment during assembly.

Minimum Supply Voltage: 1.7 V

Lower minimum supply voltage helps in conserving power and extending battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Horizontal Pixel: 1280

High horizontal pixel count enables high-resolution image capture with detailed image quality.

Output Range: 0.40-1.50V

Wide output range provides flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality terminal finish ensures good conductivity and long-term reliability.

Maximum Operating Current: 170 mA

High maximum operating current capability supports power-hungry operations without risk of overload.

Dynamic Range: 79 dB

Wide dynamic range allows for capturing images with varying light intensities accurately.

Vertical Pixel: 800

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 9 mm

Compact body length/diameter for ease of integration and fitting in devices.

Optical Format (inch): 1/4

Optical format compatibility with industry standards makes it suitable for various applications.

Termination Type: SOLDER

Solder termination provides secure and reliable electrical connections for long-term use.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies integration and communication with other components or systems.

Frame Rate: 60 fps

High frame rate allows for capturing fast-moving objects with smooth and clear images.

Array Type: LINEAR

Linear array type provides efficient image capture and data processing for various applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature offers easy and secure installation on PCBs or other surfaces.

Technical Specifications

Image Sensors AR0141CS2C00SUEA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT 2.50-3.10 V ANALOG SUPPLY VOLATGE

Array Type:

LINEAR

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Dynamic Range:

79 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

170 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3X3

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

800

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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