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Small Signal Field Effect Transistors (FET)

Small Signal Field Effect Transistors (FET) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.

Small Signal FETs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.

The Small Signal FET consists of a gate, source, and drain electrode, and works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through the gate electrode. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.

Proper use of Small Signal FETs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal FETs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.

Small Signal Field Effect Transistors (FET)

Available Parts 998

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Avalanche Energy Rating (EAS) Case Connection Maximum Collector Current (IC) Configuration Minimum DC Current Gain (hFE) Minimum DS Breakdown Voltage Maximum Drain Current (Abs) (ID) Maximum Drain Current (ID) Maximum Drain-Source On Resistance Field Effect Transistor Technology Maximum Feedback Capacitance (Crss) JEDEC-95 Code JESD-30 Code JESD-609 Code Moisture Sensitivity Level (MSL) No. of Elements No. of Terminals Operating Mode Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Shape Package Style (Meter) Peak Reflow Temperature (C) Polarity or Channel Type Maximum Power Dissipation Ambient Maximum Power Dissipation (Abs) Maximum Pulsed Drain Current (IDM) Qualification Reference Standard Sub-Category Surface Mount Terminal Finish Terminal Form Terminal Position Maximum Time At Peak Reflow Temperature (s) Transistor Application Transistor Element Material Maximum Turn Off Time (toff) Maximum Turn On Time (ton) Maximum VCEsat
ADG465BRMZ-REEL7 by Analog Devices

ADG465BRMZ-REEL7

Analog Devices

ADG465BRMZ-REEL7 by Analog Devices is a Small Signal FET with N/P-channel, 3 elements in series. It operates in enhancement mode for switching applications. With max ID of 0.02A and RDS(on) of 115Ω, it's ideal for surface mount designs requiring dual terminals in a small outline package.

SERIES, 3 ELEMENTS

.02 A

115 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

3

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL AND P-CHANNEL

Not Qualified

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

NTMFS4C05NT1G-001 by Onsemi

NTMFS4C05NT1G-001

Onsemi

NTMFS4C05NT1G-001 by Onsemi is a N-channel FET with 78A max drain current and 33W power dissipation. Ideal for high-power applications, it operates at up to 150 °C. Suitable for surface mount configurations in various electronic devices.

SINGLE

78 A

78 A

METAL-OXIDE SEMICONDUCTOR

1

150 Cel

N-CHANNEL

33 W

FET General Purpose Power

YES

NTMFS4C06NT1G-001 by Onsemi

NTMFS4C06NT1G-001

Onsemi

NTMFS4C06NT1G-001 by Onsemi is a N-CHANNEL FET with 69A max drain current and 30.5W power dissipation. Ideal for high-power applications, it operates up to 150 °C, making it suitable for various surface-mount designs.

SINGLE

69 A

69 A

METAL-OXIDE SEMICONDUCTOR

1

150 Cel

N-CHANNEL

30.5 W

FET General Purpose Power

YES

NTMFS4C08NT1G-001 by Onsemi

NTMFS4C08NT1G-001

Onsemi

NTMFS4C08NT1G-001 by Onsemi is a N-channel FET with 52A max drain current and 25.5W power dissipation. Ideal for high-power applications, it operates at up to 150°C. Suitable for surface mount designs, this MOSFET offers reliable performance in various electronic circuits.

SINGLE

52 A

52 A

METAL-OXIDE SEMICONDUCTOR

1

150 Cel

N-CHANNEL

25.5 W

FET General Purpose Power

YES

NTMFS4C10NT1G-001 by Onsemi

NTMFS4C10NT1G-001

Onsemi

NTMFS4C10NT1G-001 by Onsemi is a N-CHANNEL FET with 46A max drain current and 23.6W power dissipation. Ideal for high-power applications, it operates up to 150°C, making it suitable for various surface-mount designs.

SINGLE

46 A

46 A

METAL-OXIDE SEMICONDUCTOR

1

150 Cel

N-CHANNEL

23.6 W

FET General Purpose Power

YES

SFT1341-TL-W by Onsemi

SFT1341-TL-W

Onsemi

The Onsemi SFT1341-TL-W is a P-CHANNEL FET with 10A max drain current and 15W max power dissipation. Ideal for applications requiring high temperature resistance up to 150 °C, such as automotive electronics and industrial control systems.

SINGLE

10 A

10 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

260

P-CHANNEL

15 W

Other Transistors

YES

TIN BISMUTH

30

SFT1341-W by Onsemi

SFT1341-W

Onsemi

The Onsemi SFT1341-W is a P-CHANNEL FET with 10A max drain current and 15W max power dissipation. Ideal for applications requiring high power handling in temperatures up to 150 °C, such as power management circuits or motor control systems.

SINGLE

10 A

10 A

METAL-OXIDE SEMICONDUCTOR

e6

1

150 Cel

P-CHANNEL

15 W

Other Transistors

NO

Tin/Bismuth (Sn/Bi)

SFT1342-TL-W by Onsemi

SFT1342-TL-W

Onsemi

The Onsemi SFT1342-TL-W is a P-CHANNEL FET with 12A max drain current and 15W power dissipation. Ideal for surface mount applications, it operates up to 150°C and features metal-oxide semiconductor technology. Suitable for various electronic circuits requiring high-power handling in compact designs.

SINGLE

12 A

12 A

METAL-OXIDE SEMICONDUCTOR

e6

1

1

150 Cel

260

P-CHANNEL

15 W

Other Transistors

YES

TIN BISMUTH

30

SFT1342-W by Onsemi

SFT1342-W

Onsemi

The Onsemi SFT1342-W is a P-CHANNEL FET with 12A max drain current and 15W power dissipation. Ideal for applications requiring high power handling in temperatures up to 150°C, it features metal-oxide semiconductor technology and tin bismuth terminal finish.

SINGLE

12 A

12 A

METAL-OXIDE SEMICONDUCTOR

e6

1

150 Cel

P-CHANNEL

15 W

Other Transistors

NO

TIN BISMUTH

NTMS4107NR2G by Onsemi

NTMS4107NR2G

Onsemi

NTMS4107NR2G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 15A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a low on-resistance of 0.0045 ohm.

SINGLE WITH BUILT-IN DIODE

30 V

15 A

11 A

.0045 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

2.5 W

Not Qualified

FET General Purpose Power

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

SI2303BDS-T1-E3 by Vishay Intertechnology

SI2303BDS-T1-E3

Vishay Intertechnology

Vishay Intertechnology's SI2303BDS-T1-E3 is a P-CHANNEL FET with 30V DS Breakdown Voltage and 1.49A Drain Current. Ideal for small outline applications, it operates in Enhancement Mode with 0.2 ohm On Resistance, making it suitable for high temperature environments up to 150°C.

SINGLE WITH BUILT-IN DIODE

30 V

1.49 A

1.49 A

.2 ohm

METAL-OXIDE SEMICONDUCTOR

TO-236

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

.9 W

Not Qualified

Other Transistors

YES

Matte Tin (Sn)

GULL WING

DUAL

30

SILICON

DMN5L06DW-7 by Diodes Incorporated

DMN5L06DW-7

Diodes Incorporated

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;

LOW CAPACITANCE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-G6

e3

1

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.2 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

DMN5L06V-7 by Diodes Incorporated

DMN5L06V-7

Diodes Incorporated

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .15 W; Maximum Drain Current (ID): .28 A; No. of Elements: 2;

LOW CAPACITANCE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-F6

e3

1

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.15 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

FLAT

DUAL

30

SWITCHING

SILICON

DMN5L06VA-7 by Diodes Incorporated

DMN5L06VA-7

Diodes Incorporated

N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .15 W; Terminal Form: FLAT; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

LOW CAPACITANCE

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-F6

e3

1

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.15 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

FLAT

DUAL

30

SWITCHING

SILICON

BSS192PE6327 by Infineon Technologies

BSS192PE6327

Infineon Technologies

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1 W; Package Style (Meter): SMALL OUTLINE; Additional Features: LOGIC LEVEL COMPATIBLE;

LOGIC LEVEL COMPATIBLE

DRAIN

SINGLE WITH BUILT-IN DIODE

250 V

.19 A

.19 A

12 ohm

METAL-OXIDE SEMICONDUCTOR

8 pF

R-PSSO-F3

1

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

255

P-CHANNEL

1 W

Not Qualified

AEC-Q101

Other Transistors

YES

FLAT

SINGLE

SILICON

DMN5L06-7 by Diodes Incorporated

DMN5L06-7

Diodes Incorporated

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; JESD-609 Code: e3; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

SINGLE WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.35 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

DMN5L06T-7 by Diodes Incorporated

DMN5L06T-7

Diodes Incorporated

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .15 W; Operating Mode: ENHANCEMENT MODE; Transistor Element Material: SILICON;

LOW CAPACITANCE

SINGLE WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.15 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

DMN5L06W-7 by Diodes Incorporated

DMN5L06W-7

Diodes Incorporated

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 150 Cel;

SINGLE WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.2 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

RSF010P03TL by ROHM

RSF010P03TL

ROHM

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .8 W; Package Body Material: PLASTIC/EPOXY; Maximum Drain-Source On Resistance: .35 ohm;

SINGLE WITH BUILT-IN DIODE

30 V

1 A

1 A

.35 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-F3

e2

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

.8 W

Not Qualified

Other Transistors

YES

TIN COPPER

FLAT

DUAL

10

SWITCHING

SILICON

RTF015N03TL by ROHM

RTF015N03TL

ROHM

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .8 W; Package Body Material: PLASTIC/EPOXY; Transistor Application: SWITCHING;

SINGLE WITH BUILT-IN DIODE

30 V

1.5 A

1.5 A

.34 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-F3

e2

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.8 W

Not Qualified

FET General Purpose Power

YES

TIN COPPER

FLAT

DUAL

10

SWITCHING

SILICON

SI4884BDY-T1-E3 by Vishay Intertechnology

SI4884BDY-T1-E3

Vishay Intertechnology

SI4884BDY-T1-E3 by Vishay Intertechnology is a N-CHANNEL FET with 30V DS Breakdown Voltage, 16.5A Drain Current, and 0.009 ohm On Resistance. Ideal for SWITCHING applications in ENHANCEMENT MODE, this transistor has a max power dissipation of 4.45W and operates up to 150°C temperature.

SINGLE WITH BUILT-IN DIODE

30 V

16.5 A

12.4 A

.009 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

4.45 W

Not Qualified

FET General Purpose Powers

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

DMN5L06VAK-7 by Diodes Incorporated

DMN5L06VAK-7

Diodes Incorporated

DMN5L06VAK-7 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, 0.28A max drain current, and 3 ohm max on resistance. Ideal for switching applications, it operates in enhancement mode with a temp range of -55 to 150°C. Suitable for small outline packages, it features separate elements with built-in diode and AEC-Q101 compliance.

HIGH RELIABILITY

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-F6

e3

1

2

6

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.25 W

Not Qualified

AEC-Q101

FET General Purpose Powers

YES

MATTE TIN

FLAT

DUAL

30

SWITCHING

SILICON

DMN5L06VK-7 by Diodes Incorporated

DMN5L06VK-7

Diodes Incorporated

DMN5L06VK-7 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, 0.28A max drain current, and 3 ohm max on resistance. Ideal for switching applications, it operates in enhancement mode with a temp range of -55 to 150°C. It comes in a small outline package with matte tin finish and AEC-Q101 standard compliance.

HIGH RELIABILITY

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

50 V

.28 A

.28 A

3 ohm

METAL-OXIDE SEMICONDUCTOR

5 pF

R-PDSO-F6

e3

1

2

6

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.25 W

Not Qualified

AEC-Q101

FET General Purpose Powers

YES

MATTE TIN

FLAT

DUAL

30

SWITCHING

SILICON

NTJS4160NT1G by Onsemi

NTJS4160NT1G

Onsemi

NTJS4160NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max ID of 1.8A and 0.06 ohm RDS(ON), in a small outline package with GULL WING terminals for surface mount assembly.

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

30 V

1.8 A

.06 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G6

e3

1

1

6

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

Not Qualified

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

NTMD6P02R2SG by Onsemi

NTMD6P02R2SG

Onsemi

NTMD6P02R2SG by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, 6.2A Drain Current, and 0.033 ohm On Resistance. Ideal for SWITCHING applications, it features a RECTANGULAR package with GULL WING terminals and operates in ENHANCEMENT MODE up to 150 °C.

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

6.2 A

4.8 A

.033 ohm

METAL-OXIDE SEMICONDUCTOR

450 pF

R-PDSO-G8

e3

1

2

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

2 W

Not Qualified

Other Transistors

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

NTMS4705NR2G by Onsemi

NTMS4705NR2G

Onsemi

NTMS4705NR2G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 10A Drain Current, and 0.01 ohm On Resistance. Ideal for SWITCHING applications in ENHANCEMENT MODE, it features GULL WING terminals and operates up to 150 °C.

SINGLE WITH BUILT-IN DIODE

30 V

10 A

7.4 A

.01 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

1.52 W

Not Qualified

FET General Purpose Power

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

NTMS4706NR2G by Onsemi

NTMS4706NR2G

Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Terminal Form: GULL WING;

SINGLE WITH BUILT-IN DIODE

30 V

6.4 A

.012 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

Not Qualified

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

NTGS3441PT1G by Onsemi

NTGS3441PT1G

Onsemi

NTGS3441PT1G by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage and 1.8A max drain current. Ideal for switching applications, it features a built-in diode, 0.11 ohm on resistance, and operates in enhancement mode. This small outline transistor has 6 terminals and GULL WING form factor for surface mount assembly.

SINGLE WITH BUILT-IN DIODE

20 V

1.8 A

.11 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G6

e3

1

1

6

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

Not Qualified

YES

TIN

GULL WING

DUAL

30

SWITCHING

SILICON

NTMSD3P102R2SG by Onsemi

NTMSD3P102R2SG

Onsemi

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Peak Reflow Temperature (C): NOT SPECIFIED;

SINGLE WITH BUILT-IN DIODE

20 V

2.34 A

2.34 A

.085 ohm

METAL-OXIDE SEMICONDUCTOR

135 pF

R-PDSO-G8

e3

3

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

P-CHANNEL

2 W

Not Qualified

Other Transistors

YES

Tin (Sn)

GULL WING

DUAL

NOT SPECIFIED

SWITCHING

SILICON

BSS127E6327 by Infineon Technologies

BSS127E6327

Infineon Technologies

Infineon's BSS127E6327 is a N-CHANNEL FET with 600V DS breakdown voltage, 0.021A max drain current, and 600 ohm max on resistance. Ideal for small signal applications, it features a built-in diode and operates in enhancement mode. The PLASTIC/EPOXY package with GULL WING terminals can handle up to 150°C operating temperature.

SINGLE WITH BUILT-IN DIODE

600 V

.021 A

.021 A

600 ohm

METAL-OXIDE SEMICONDUCTOR

1.5 pF

R-PDSO-G3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.5 W

Not Qualified

FET General Purpose Power

YES

GULL WING

DUAL

SILICON

BSS139E6906 by Infineon Technologies

BSS139E6906

Infineon Technologies

Infineon's BSS139E6906 is a N-CHANNEL FET with 250V DS Breakdown Voltage, 0.1A ID, and 30 ohm RDS(on). Ideal for small signal applications, it features a built-in diode in a PLASTIC/EPOXY package. Operating in DEPLETION MODE, this transistor has a max temp of 150°C and 3.3pF Crss.

SINGLE WITH BUILT-IN DIODE

250 V

.1 A

.1 A

30 ohm

METAL-OXIDE SEMICONDUCTOR

3.3 pF

R-PDSO-G3

1

3

DEPLETION MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

.36 W

Not Qualified

FET General Purpose Power

YES

GULL WING

DUAL

NOT SPECIFIED

SILICON

NTVS3141PT2G by Onsemi

NTVS3141PT2G

Onsemi

NTVS3141PT2G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max ID of 3.7A and 0.2 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 150 °C. This RECTANGULAR GRID ARRAY package has 6 terminals with BALL form, suitable for surface mount designs.

SINGLE WITH BUILT-IN DIODE

20 V

3.7 A

2.9 A

.2 ohm

METAL-OXIDE SEMICONDUCTOR

R-PBGA-B6

e3

1

1

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY

P-CHANNEL

1.5 W

Not Qualified

Other Transistors

YES

MATTE TIN

BALL

BOTTOM

SWITCHING

SILICON

DMN4027SSS-13 by Diodes Incorporated

DMN4027SSS-13

Diodes Incorporated

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.8 W; Terminal Position: DUAL; Terminal Finish: MATTE TIN;

HIGH RELIABILITY

SINGLE WITH BUILT-IN DIODE

40 V

8 A

6 A

.027 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

2.8 W

Not Qualified

FET General Purpose Powers

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

ZXMP6A17N8TC by Diodes Incorporated

ZXMP6A17N8TC

Diodes Incorporated

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Qualification: Not Qualified; No. of Terminals: 8;

HIGH RELIABILITY

SINGLE WITH BUILT-IN DIODE

60 V

2.7 A

.125 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

Not Qualified

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

BSS138NE6327 by Infineon Technologies

BSS138NE6327

Infineon Technologies

BSS138NE6327 by Infineon is a N-CHANNEL FET with 60V DS breakdown voltage and 0.23A max drain current. Ideal for small outline applications, it operates in enhancement mode with 3.5 ohm RDS(on) and 3.8pF Crss, meeting MIL-STD-883 standards at -55 to 150°C temperature range.

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.23 A

.23 A

3.5 ohm

METAL-OXIDE SEMICONDUCTOR

3.8 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.36 W

.36 W

Not Qualified

MIL-STD-883

FET General Purpose Power

YES

Matte Tin (Sn)

GULL WING

DUAL

40

SILICON

BSS138NE6433 by Infineon Technologies

BSS138NE6433

Infineon Technologies

BSS138NE6433 by Infineon Technologies is a small signal N-channel FET with a min DS breakdown voltage of 60V. It is surface mountable and has a max drain current of 0.23A. This transistor is commonly used in applications requiring enhancement mode operation and low power dissipation.

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.23 A

.23 A

3.5 ohm

METAL-OXIDE SEMICONDUCTOR

3.8 pF

R-PDSO-G3

1

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.36 W

.36 W

Not Qualified

MIL-STD-883

FET General Purpose Power

YES

GULL WING

DUAL

SILICON

BSS126E6327 by Infineon Technologies

BSS126E6327

Infineon Technologies

BSS126E6327 by Infineon Technologies is a N-CHANNEL FET with 600V DS breakdown voltage, 0.021A max drain current, and 500 ohm max on resistance. It is used in small signal applications requiring depletion mode operation, such as power management circuits due to its 0.5W power dissipation and compact gull wing package design.

SINGLE WITH BUILT-IN DIODE

600 V

.021 A

.021 A

500 ohm

METAL-OXIDE SEMICONDUCTOR

1.5 pF

R-PDSO-G3

e3

1

3

DEPLETION MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.5 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SILICON

BSS126E6906 by Infineon Technologies

BSS126E6906

Infineon Technologies

BSS126E6906 by Infineon Technologies is a N-CHANNEL FET with 600V DS breakdown voltage, 0.021A max drain current, and 500 ohm max on resistance. Ideal for applications requiring small outline packages, such as power supplies and motor control systems.

SINGLE WITH BUILT-IN DIODE

600 V

.021 A

.021 A

500 ohm

METAL-OXIDE SEMICONDUCTOR

1.5 pF

R-PDSO-G3

e3

1

3

DEPLETION MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

.5 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SILICON

BSS159NE6327 by Infineon Technologies

BSS159NE6327

Infineon Technologies

BSS159NE6327 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.23A Drain Current, and 3.5 ohm On Resistance. Ideal for small signal applications in electronics due to its DEPLETION MODE operation and compact SMALL OUTLINE package style.

SINGLE WITH BUILT-IN DIODE

60 V

.23 A

.23 A

3.5 ohm

METAL-OXIDE SEMICONDUCTOR

5.9 pF

R-PDSO-G3

e3

1

1

3

DEPLETION MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.36 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SILICON

BSS159NE6906 by Infineon Technologies

BSS159NE6906

Infineon Technologies

Infineon's BSS159NE6906 is a N-CHANNEL FET with 60V DS breakdown voltage, 0.23A max drain current, and 3.5 ohm max on resistance. Ideal for small signal applications requiring low power dissipation in surface mount configurations.

SINGLE WITH BUILT-IN DIODE

60 V

.23 A

.23 A

3.5 ohm

METAL-OXIDE SEMICONDUCTOR

5.9 pF

R-PDSO-G3

e3

1

3

DEPLETION MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

.36 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SILICON

NTMS4840NR2G by Onsemi

NTMS4840NR2G

Onsemi

NTMS4840NR2G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 5.5A ID. Ideal for SWITCHING applications, it features 0.024 ohm RDS(ON) and a built-in DIODE in a GULL WING package style.

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

5.5 A

.024 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

Not Qualified

YES

Tin (Sn)

GULL WING

DUAL

NOT SPECIFIED

SWITCHING

SILICON

IRF5851TRPBF by International Rectifier

IRF5851TRPBF

International Rectifier

IRF5851TRPBF by International Rectifier is a Small Signal FET with N-Channel and P-Channel polarity. It features 2 elements with built-in diode for switching applications, operating in enhancement mode. With a max drain current of 2.7A and a min DS breakdown voltage of 20V, it is suitable for various electronic circuits requiring high performance in a small outline package.

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

20 V

2.7 A

2.7 A

.09 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G6

e3

2

2

6

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL AND P-CHANNEL

.96 W

Not Qualified

Other Transistors

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

BSS138WL6327 by Infineon Technologies

BSS138WL6327

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .28 A;

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.28 A

.28 A

3.5 ohm

METAL-OXIDE SEMICONDUCTOR

4.2 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.5 W

.5 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

BSS138WL6433 by Infineon Technologies

BSS138WL6433

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Minimum DS Breakdown Voltage: 60 V; Maximum Drain Current (Abs) (ID): .28 A;

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.28 A

.28 A

3.5 ohm

METAL-OXIDE SEMICONDUCTOR

4.2 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.5 W

.5 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

SN7002NE6327 by Infineon Technologies

SN7002NE6327

Infineon Technologies

Infineon's SN7002NE6327 is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.2A ID, and 5 ohm RDS. Ideal for small signal applications, it features a built-in diode in a GULL WING package suitable for surface mount technology. Operating in enhancement mode at up to 150°C, this MOSFET offers low feedback capacitance of 4.2pF.

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.2 A

.2 A

5 ohm

METAL-OXIDE SEMICONDUCTOR

4.2 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.36 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SILICON

SN7002NL6327 by Infineon Technologies

SN7002NL6327

Infineon Technologies

Infineon's SN7002NL6327 is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.2A ID, and 5 ohm RDS(ON). Ideal for small outline applications, it operates in enhancement mode with a max power dissipation of 0.36W. The transistor features a built-in diode and can withstand temperatures up to 150°C.

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.2 A

.2 A

5 ohm

METAL-OXIDE SEMICONDUCTOR

4.2 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.36 W

Not Qualified

FET General Purpose Power

YES

Matte Tin (Sn)

GULL WING

DUAL

40

SILICON

SN7002WL6327 by Infineon Technologies

SN7002WL6327

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Feedback Capacitance (Crss): 4.5 pF; Peak Reflow Temperature (C): 260;

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.23 A

.23 A

5 ohm

METAL-OXIDE SEMICONDUCTOR

4.5 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.5 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SILICON

SN7002WL6433 by Infineon Technologies

SN7002WL6433

Infineon Technologies

Infineon's SN7002WL6433 is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.23A ID, and 5 ohm RDS(on). Ideal for small outline applications, it operates in enhancement mode with a max power dissipation of 0.5W.

LOGIC LEVEL COMPATIBLE

SINGLE WITH BUILT-IN DIODE

60 V

.23 A

.23 A

5 ohm

METAL-OXIDE SEMICONDUCTOR

4.5 pF

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

.5 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SILICON