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SI2303BDS-T1-E3

Vishay Intertechnology

SI2303BDS-T1-E3 by Vishay Intertechnology

Vishay Intertechnology's SI2303BDS-T1-E3 is a P-CHANNEL FET with 30V DS Breakdown Voltage and 1.49A Drain Current. Ideal for small outline applications, it operates in Enhancement Mode with 0.2 ohm On Resistance, making it suitable for high temperature environments up to 150°C.

Median Price

$0.272

Lifecycle Status

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15

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1k+

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Nova Conductors

Japan . 94 parts In-Stock

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$0.254

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American Microsemiconductor Inc.

USA . 2,500 parts In-Stock

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$0.290

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Vyrian

USA . 13,053 parts In-Stock

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R&J Components

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ComSIT Distribution GmbH

Germany . 4,560 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4,226 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,514 parts In-Stock

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Rebound Electronics

UK . 3,000 parts In-Stock

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EMSNET

USA . 2,848 parts In-Stock

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Inventory MP

USA . 727 parts In-Stock

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Semi Source

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,384 parts In-Stock

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$0.050

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Continental Prestige Electronics

USA . 5,730 parts In-Stock

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$0.254

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$0.249

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Argo Parts USA

USA . 3,753 parts In-Stock

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$0.254

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$0.246

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Corohmni

South Africa . 95 parts In-Stock

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$0.685

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Aztec Data Supply Inc.

USA . 3,063 parts In-Stock

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AZTECH Wire

Italy . 623 parts In-Stock

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Semicontronic

India . 1,231 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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S.R.D Solutions

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GreenTree Electronics

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Authorized Procurement Solutions

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Assy Fe

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Computer Components Inc. - USA

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Overview

Elevate your electronics with the SI2303BDS-T1-E3 by Vishay Intertechnology, a top-tier manufacturer known for quality products. This small signal field-effect transistor offers unparalleled performance in a P-channel configuration with a built-in diode, perfect for a wide range of applications. With a minimum DS breakdown voltage of 30V and maximum drain current of 1.49A, this enhancement mode transistor is a game-changer for any project. Experience the value and benefits of Vishay Intertechnology's expertise with the SI2303BDS-T1-E3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring its durability and reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high current-carrying capability, making this transistor suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more versatile circuit designs and can protect against reverse voltage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage ensures the transistor can handle higher voltages without failure, increasing the overall robustness of the circuit.

Package Shape: RECTANGULAR

Rectangular packages are common and easy to work with, making the transistor compatible with standard PCB layouts and assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and operate, providing flexibility in circuit design and functionality.

Maximum Drain Current (Abs) (ID): 1.49 A

With a high maximum drain current, this transistor can handle heavy loads and high power applications effectively.

Maximum Power Dissipation (Abs): 0.9 W

The high power dissipation capability ensures the transistor can operate reliably under different load conditions without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low input capacitance and high switching speeds, making this transistor suitable for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) SI2303BDS-T1-E3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.49 A

Maximum Drain Current (ID):

1.49 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

SI2303BDS-T1-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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