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BSS138LT3

Onsemi

BSS138LT3 by Onsemi

BSS138LT3 by Onsemi is a N-CHANNEL FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm max on resistance. Ideal for switching applications, it operates in enhancement mode with a temp range of -55 to 150 °C. It comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

$1.193

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 450 parts In-Stock

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$1.193

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$1.133

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$1.133

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450

$1.193

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$1.133

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Flip Electronics (Authorized)

USA . 4,965,000 parts In-Stock

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Digiode

USA . 449 parts In-Stock

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$1.133

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449

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Vyrian

USA . 2,482,608 parts In-Stock

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Chip Stock

USA . 266,020 parts In-Stock

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Flip Electronics

USA . 1,000 parts In-Stock

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Nova Conductors

Japan . 800 parts In-Stock

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800

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Distributors (Availability)

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Semicontronic

India . 2,482,548 parts In-Stock

1+ parts

$1.010

100+ parts

$0.985

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$0.980

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2,482,548

$1.010

$0.985

$0.980

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Corphita

USA . 147 parts In-Stock

1+ parts

$1.074

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147

$1.074

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$1.193

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$1.133

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450

$1.193

$1.133

$1.133

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Corohmni

South Africa . 142 parts In-Stock

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$1.193

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142

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Aztec Data Supply Inc.

USA . 990 parts In-Stock

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$1.691

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990

$1.691

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Component Stockers USA

USA . 551 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 22,478 parts In-Stock

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Problanco Electronics

Mexico . 7,810 parts In-Stock

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TANS Electronics

Latvia . 7,495 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Kulean Microsystems

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SupplyDigital Components

Austria . 2,166 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 525 parts In-Stock

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Kepictronics

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Modulus Dynamics

Lithuania . 46 parts In-Stock

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Lucentia Tech

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Overview

Enhance your electronic designs with the BSS138LT3 by Onsemi, a top-quality N-channel small signal field-effect transistor that offers reliable switching capabilities. Manufactured by Onsemi, a trusted name in semiconductor technology, this FET boasts a single configuration with a built-in diode, making it ideal for various applications. From enhancing performance to improving efficiency, this transistor provides value and benefits that are unmatched. Upgrade your projects today with the BSS138LT3 and experience the advantages of superior quality and performance.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and lightweight material for long-lasting performance.

Polarity or Channel Type:

N-CHANNEL - Provides efficient switching capabilities.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space.

Transistor Application:

SWITCHING - Ideal for applications requiring fast switching speeds.

Surface Mount:

YES - Easy to mount on circuit boards for convenient assembly.

Minimum DS Breakdown Voltage:

50 V - Offers high voltage tolerance for reliable operation.

Package Shape:

RECTANGULAR - Fits well in compact circuits for space-saving designs.

Terminal Form:

GULL WING - Ensures secure connections for optimal performance.

Operating Mode:

ENHANCEMENT MODE - Allows for precise control of the transistor's conductivity.

Maximum Drain Current (Abs) (ID):

0.2 A - Handles moderate current loads efficiently.

No. of Terminals:

3 - Simple interface for easy integration into circuits.

Package Style (Meter):

SMALL OUTLINE - Perfect for small electronic devices with limited space.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Provides high switching speeds and low power consumption.

Maximum Operating Temperature:

150 °C - Offers wide temperature range for versatile use.

Transistor Element Material:

SILICON - Ensures high performance and reliability.

Minimum Operating Temperature:

55 °C - Can operate in extreme cold conditions without issues.

Terminal Finish:

Tin/Lead (Sn80Pb20) - Prevents corrosion and ensures long-term stability.

Maximum Drain-Source On Resistance:

3.5 ohm - Low resistance for efficient power flow.

Terminal Position:

DUAL - Allows for flexible installation in different circuit configurations.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable solder connections during assembly.

Peak Reflow Temperature °C:

235 - Compatible with standard reflow soldering processes.

Maximum Feedback Capacitance (Crss):

5 pF - Low capacitance for minimal signal loss and distortion.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS138LT3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

.2 A

Maximum Drain Current (ID):

.2 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS138LT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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