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SN7002NE6327

Infineon Technologies

SN7002NE6327 by Infineon Technologies

Infineon's SN7002NE6327 is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.2A ID, and 5 ohm RDS. Ideal for small signal applications, it features a built-in diode in a GULL WING package suitable for surface mount technology. Operating in enhancement mode at up to 150°C, this MOSFET offers low feedback capacitance of 4.2pF.

Median Price

$0.055

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,957 parts In-Stock

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-

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$0.055

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$0.045

10k+ parts

$0.041

3,957

-

$0.055

$0.045

$0.041

Distributors (In-Stock)

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Nova Conductors

Japan . 52 parts In-Stock

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$0.042

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-

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52

$0.042

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Digiode

USA . 498 parts In-Stock

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$0.043

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498

$0.043

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American Microsemiconductor Inc.

USA . 2,990 parts In-Stock

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$0.380

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2,990

$0.380

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Vyrian

USA . 3,692 parts In-Stock

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3,692

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Component Sense

UK . 2,393 parts In-Stock

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$0.030

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$0.030

2,393

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$0.030

Bristol Electronics

USA . 1,300 parts In-Stock

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1,300

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Atlantic Semiconductor

USA . 1,300 parts In-Stock

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1,300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,933 parts In-Stock

1+ parts

$0.038

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-

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3,933

$0.038

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Corphita

USA . 436 parts In-Stock

1+ parts

$0.040

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436

$0.040

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Argo Parts USA

USA . 4,805 parts In-Stock

1+ parts

$0.042

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$0.041

4,805

$0.042

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$0.041

Continental Prestige Electronics

USA . 924 parts In-Stock

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$0.042

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$0.041

924

$0.042

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Bastille Electronics

Australia . 10 parts In-Stock

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$0.042

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$0.040

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$0.038

10k+ parts

$0.037

10

$0.042

$0.040

$0.038

$0.037

Modulus Dynamics

Lithuania . 4,186 parts In-Stock

1+ parts

$0.364

100+ parts

$0.349

1k+ parts

$0.335

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4,186

$0.364

$0.349

$0.335

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AZTECH Wire

Italy . 742 parts In-Stock

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$19.190

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Perfect Parts

USA . 67,200 parts In-Stock

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GreenTree Electronics

Israel . 60,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,282 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,624 parts In-Stock

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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Kepictronics

USA . 3,400 parts In-Stock

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Assy Fe

Spain . 156 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SN7002NE6327 by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and reliability in their products. This Small Signal Field Effect Transistor (FET) is a game-changer in various applications, offering unmatched performance and efficiency. With a built-in diode and N-channel configuration, this transistor maximizes power while minimizing energy consumption. Experience the benefits of enhanced mode operation, high breakdown voltage, and low on-resistance all in one compact package. Upgrade your electronics with the SN7002NE6327 and step into the future of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse current flow.

Surface Mount: YES

Surface mounting capability makes installation easier and saves space on the PCB.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliability and protection against voltage spikes.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and soldering on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, making them suitable for various applications.

Maximum Drain Current (ID): 0.2 A

The high maximum drain current rating allows for use in applications with higher power requirements.

No. of Terminals: 3

Having 3 terminals allows for easy connectivity and control in circuits.

Maximum Power Dissipation (Abs): 0.36 W

The high power dissipation rating ensures the FET can handle heat generated during operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance for efficient performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for use in a wide range of environments.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability in various applications.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and conductivity for reliable connections.

Maximum Drain-Source On Resistance: 5 ohm

Low on-resistance allows for efficient current flow and reduces power losses.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and easy integration.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during manufacturing.

Maximum Feedback Capacitance (Crss): 4.2 pF

Low feedback capacitance minimizes signal distortion and improves high-frequency performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) SN7002NE6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.2 A

Maximum Drain Current (ID):

.2 A

Maximum Drain-Source On Resistance:

5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4.2 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

SN7002NE6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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