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FDN327N

Onsemi

FDN327N by Onsemi

FDN327N by Onsemi is a N-CHANNEL FET with 20V DS Breakdown Voltage and 2A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has 0.07 ohm On Resistance and can handle up to 0.46W power dissipation at 150°C.

Median Price

$0.116

Lifecycle Status

Suppliers In-Stock

46

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 10,595 parts In-Stock

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$0.088

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$0.088

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$0.088

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10,595

$0.088

$0.088

$0.088

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Mouser Electronics

USA . 63,706 parts In-Stock

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$0.640

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$0.254

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$0.192

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63,706

$0.640

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$0.192

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DigiKey

USA . 58,375 parts In-Stock

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$0.640

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$0.254

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$0.172

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58,375

$0.640

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Future Electronics

Canada . 828,000 parts In-Stock

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Verical

USA . 183,000 parts In-Stock

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Rochester

USA . 54,812 parts In-Stock

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$0.134

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$0.111

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$0.099

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Element14

Singapore . 51,770 parts In-Stock

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$0.225

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Master Electronics

USA . 44,750 parts In-Stock

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$0.098

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$0.086

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Farnell

UK . 44,222 parts In-Stock

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$0.183

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$0.156

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RS (Exports)

UK . 18,575 parts In-Stock

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Arrow

USA . 18,000 parts In-Stock

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Avnet

USA . 9,000 parts In-Stock

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Chip1Stop

Japan . 8,900 parts In-Stock

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Distrelec

Netherlands . 2,540 parts In-Stock

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Digiode

USA . 916 parts In-Stock

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TME

Poland . 1,661 parts In-Stock

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$0.592

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1,661

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$0.130

Nova Conductors

Japan . 650 parts In-Stock

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Component Electronics Inc.

Canada . 1,400 parts In-Stock

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$1.730

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$1.500

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Ozdisan Elektronik

Türkiye . 2,935 parts In-Stock

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$68.332

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IBS Electronics

USA . 1,580,750 parts In-Stock

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NAC Semi

USA . 762,000 parts In-Stock

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Vyrian

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Bristol Electronics

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Chip Stock

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ComSIT Distribution GmbH

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Atlantic Semiconductor

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Semtec, LLC

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Lantek

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Semi Source

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Microfarads

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 580 parts In-Stock

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Inventory MP

USA . 255 parts In-Stock

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Halfin

Belgium . 100 parts In-Stock

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Electronics Depot

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Manoshevitz Elec. Sales

Israel . 27 parts In-Stock

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Ampacity Inc.

Singapore . 39,507 parts In-Stock

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$0.080

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Semicontronic

India . 39,278 parts In-Stock

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$0.078

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Corphita

USA . 1,290 parts In-Stock

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Corohmni

South Africa . 167 parts In-Stock

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Argo Parts USA

USA . 4,456 parts In-Stock

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$0.152

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Continental Prestige Electronics

USA . 22,452 parts In-Stock

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$0.467

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$0.217

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$0.128

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Aztec Data Supply Inc.

USA . 3,161 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$0.752

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$0.684

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$0.617

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$0.752

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$0.617

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Aranea Global

USA . 1,000 parts In-Stock

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$0.980

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$0.941

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$0.980

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GreenTree Electronics

Israel . 120,000 parts In-Stock

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Perfect Parts

USA . 79,055 parts In-Stock

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RC Electronics

USA . 76,930 parts In-Stock

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$0.160

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$0.140

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iodParts Technologies Inc.

India . 15,955 parts In-Stock

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Futuretech Components

Singapore . 15,000 parts In-Stock

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Robosynatics

Brazil . 10,466 parts In-Stock

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$0.151

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$0.148

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$0.148

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Lucentia Tech

USA . 10,466 parts In-Stock

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$0.151

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$0.148

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$0.148

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TANS Electronics

Latvia . 7,987 parts In-Stock

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SupplyDigital Components

Austria . 7,627 parts In-Stock

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Lixinc

USA . 6,593 parts In-Stock

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Assy Fe

Spain . 6,039 parts In-Stock

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Kepictronics

USA . 5,827 parts In-Stock

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Benley Electronics

USA . 4,675 parts In-Stock

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Eastek

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Formix International (Excess)

India . 1,538 parts In-Stock

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Kulean Microsystems

USA . 1,284 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 758 parts In-Stock

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Israel . 187 parts In-Stock

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Problanco Electronics

Mexico . 103 parts In-Stock

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Overview

Enhance your electronics projects with the FDN327N Small Signal Field Effect Transistor by Onsemi. With a reputation for quality and reliability, Onsemi delivers cutting-edge technology in every product they manufacture. The FDN327N is ideal for switching applications, offering a maximum drain current of 2A and a low on resistance of just 0.07 ohms. Its compact design, with a small outline package shape and gull wing terminals, makes it perfect for surface mount applications. Trust Onsemi to provide you with the value and performance you need for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the transistor lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are often more efficient and have better performance compared to their P-channel counterparts, making this transistor a good choice for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the transistor from reverse polarity and can simplify the circuit design, making this transistor convenient and versatile for different applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low on-resistance, making it suitable for high-frequency switching circuits.

Surface Mount: YES

Being surface mountable makes this transistor easy to install and suitable for automated assembly processes, saving time and effort during production.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages without breaking down, adding reliability to the circuit it is used in.

Maximum Drain Current (ID): 2 A

The high maximum drain current rating of 2A allows this transistor to handle higher current loads, making it suitable for applications that require higher power levels.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high operating temperatures without compromising its performance, making it suitable for harsh environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDN327N attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDN327N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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