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NTMS4705NR2G

Onsemi

NTMS4705NR2G by Onsemi

NTMS4705NR2G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 10A Drain Current, and 0.01 ohm On Resistance. Ideal for SWITCHING applications in ENHANCEMENT MODE, it features GULL WING terminals and operates up to 150 °C.

Median Price

$0.296

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,323 parts In-Stock

1+ parts

-

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$0.291

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$0.241

10k+ parts

$0.215

5,323

-

$0.291

$0.241

$0.215

Verical

USA . 4,694 parts In-Stock

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$0.301

4,694

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$0.301

Distributors (In-Stock)

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Digiode

USA . 1,840 parts In-Stock

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$0.226

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1,840

$0.226

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Vyrian

USA . 8,398 parts In-Stock

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8,398

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Cyclops Electronics Ltd

UK . 2,610 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 829 parts In-Stock

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829

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Distributors (Availability)

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Corphita

USA . 1,314 parts In-Stock

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$0.214

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$0.214

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Corohmni

South Africa . 185 parts In-Stock

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$0.238

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$0.238

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Benley Electronics

USA . 8 parts In-Stock

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$1.000

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8

$1.000

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AZTECH Wire

Italy . 368 parts In-Stock

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$8.690

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368

$8.690

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Perfect Parts

USA . 40,618 parts In-Stock

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40,618

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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TANS Electronics

Latvia . 8,328 parts In-Stock

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Continental Prestige Electronics

USA . 5,323 parts In-Stock

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$0.219

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A-Z Elektronik GmbH

Germany . 5,234 parts In-Stock

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Problanco Electronics

Mexico . 3,453 parts In-Stock

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SupplyDigital Components

Austria . 3,025 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 908 parts In-Stock

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Futuretech Components

Singapore . 505 parts In-Stock

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505

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Kepictronics

USA . 300 parts In-Stock

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Kulean Microsystems

USA . 215 parts In-Stock

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Overview

Experience superior performance and reliability with the NTMS4705NR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality small signal field effect transistors that are ideal for switching applications. This N-channel transistor offers enhanced efficiency and built-in diode for added convenience. With a maximum drain current of 7.4A and minimum DS breakdown voltage of 30V, this product ensures optimal functionality. Whether you're looking to upgrade your electronics or enhance your projects, the NTMS4705NR2G provides exceptional value and benefits that cater to all your needs. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material makes the transistor lightweight and durable, allowing for easy handling and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and fast switching speeds, making them suitable for various electronic circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high speed and efficiency, making it ideal for use in electronic switches.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can withstand higher voltages, ensuring reliable performance in different operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control over the transistor's conductance, improving efficiency and performance in various applications.

Maximum Drain Current (Abs) (ID): 10 A

With a maximum drain current of 10A, this transistor can handle high current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 1.52 W

With a maximum power dissipation of 1.52W, this transistor can handle power efficiently, ensuring stable operation under high loads.

Maximum Drain-Source On Resistance: 0.01 ohm

Low drain-source on resistance of 0.01 ohm minimizes power loss and improves efficiency in power switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS4705NR2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

7.4 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS4705NR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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