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NTMS4118NR2

Onsemi

NTMS4118NR2 by Onsemi

NTMS4118NR2 by Onsemi is a N-CHANNEL FET with 30V DS breakdown voltage, 9A ID, and 0.006 ohm RDS(on). It is used for switching applications in enhancement mode with built-in diode. This small outline transistor has 8 terminals, GULL WING form, and operates on metal-oxide semiconductor technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,998 parts In-Stock

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Vyrian

USA . 652 parts In-Stock

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TANS Electronics

Latvia . 7,958 parts In-Stock

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Problanco Electronics

Mexico . 5,753 parts In-Stock

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Kulean Microsystems

USA . 2,318 parts In-Stock

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SupplyDigital Components

Austria . 1,039 parts In-Stock

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UHIMA Technologies

Türkiye . 852 parts In-Stock

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Corphita

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Corohmni

South Africa . 143 parts In-Stock

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Overview

Enhance your electronic projects with the NTMS4118NR2 by Onsemi, a top-tier manufacturer known for quality and reliability. This small signal Field Effect Transistor is perfect for switching applications, offering enhanced performance and efficiency. Its N-channel configuration and built-in diode make it versatile for a range of uses. With a maximum drain current of 9A and low on-resistance, this transistor delivers exceptional value and benefits to customers looking for high-quality components. Upgrade your designs with the NTMS4118NR2 and experience the difference Onsemi can make in your electronics projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and durability, making the transistor suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-state resistance and faster switching speeds compared to P-channel transistors, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode protects the circuit from voltage spikes and reverse currents, enhancing the reliability of the transistor in switching applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, providing efficient and reliable performance in controlling current flow.

Surface Mount: YES

Surface-mount capability allows for easy integration onto printed circuit boards, saving space and facilitating automated assembly processes.

Maximum Drain Current (ID): 9 A

High maximum drain current rating of 9 A enables the transistor to handle heavy load currents, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.006 ohm

Low on-resistance results in minimal power loss and heat generation in the transistor during operation, improving efficiency and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high electron mobility and low leakage current, enhancing the performance and efficiency of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS4118NR2 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

500 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS4118NR2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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