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NTMS4177PR2G

Onsemi

NTMS4177PR2G by Onsemi

NTMS4177PR2G by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 8.9A Drain Current, 0.012 ohm On Resistance, and operates in ENHANCEMENT MODE. With a max power dissipation of 2.5W and operating temperature up to 150°C, it is suitable for various electronic designs requiring high-performance transistors.

Median Price

$0.587

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 496 parts In-Stock

1+ parts

$0.587

100+ parts

$0.418

1k+ parts

$0.377

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496

$0.587

$0.418

$0.377

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Mouser Electronics

USA . 10,086 parts In-Stock

1+ parts

$1.630

100+ parts

$0.726

1k+ parts

$0.571

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10,086

$1.630

$0.726

$0.571

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Newark

USA . 337 parts In-Stock

1+ parts

$1.650

100+ parts

$0.699

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$0.500

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337

$1.650

$0.699

$0.500

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DigiKey

USA . 2,233 parts In-Stock

1+ parts

$1.720

100+ parts

$0.726

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$0.521

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2,233

$1.720

$0.726

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Arrow

USA . 5,000 parts In-Stock

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$0.381

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Verical

USA . 5,000 parts In-Stock

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$0.383

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Master Electronics

USA . 5,000 parts In-Stock

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$0.709

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$0.465

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$0.456

5,000

-

$0.709

$0.465

$0.456

Farnell

UK . 2,477 parts In-Stock

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$0.456

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$0.371

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2,477

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$0.456

$0.371

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RS (Exports)

UK . 2,000 parts In-Stock

1+ parts

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100+ parts

$0.493

1k+ parts

$0.459

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2,000

-

$0.493

$0.459

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Element14

Singapore . 1,754 parts In-Stock

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$0.891

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$0.797

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1,754

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$0.891

$0.797

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Rochester

USA . 292 parts In-Stock

1+ parts

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100+ parts

$0.526

1k+ parts

$0.437

10k+ parts

$0.389

292

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$0.437

$0.389

Distributors (In-Stock)

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Digiode

USA . 1,182 parts In-Stock

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$0.408

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$0.408

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Nova Conductors

Japan . 10 parts In-Stock

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$0.492

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10

$0.492

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Chip Stock

USA . 33,500 parts In-Stock

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Vyrian

USA . 8,059 parts In-Stock

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8,059

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IBS Electronics

USA . 5,000 parts In-Stock

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100+ parts

$1.170

1k+ parts

$0.673

10k+ parts

$0.530

5,000

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$1.170

$0.673

$0.530

Cyclops Electronics Ltd

UK . 4,696 parts In-Stock

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4,696

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HZD GmbH

Germany . 3,138 parts In-Stock

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Flip Electronics

USA . 2,500 parts In-Stock

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Bristol Electronics

USA . 2,099 parts In-Stock

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2,099

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Goldney Electronics S.L.

Spain . 1,187 parts In-Stock

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A2Z Electronics, Inc.

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Prism Electronics

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EMSNET

USA . 23 parts In-Stock

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Speed Components Ltd

Israel . 19 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,115 parts In-Stock

1+ parts

$0.322

100+ parts

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8,115

$0.322

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Semicontronic

India . 7,946 parts In-Stock

1+ parts

$0.322

100+ parts

$0.314

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$0.312

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7,946

$0.322

$0.314

$0.312

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Corohmni

South Africa . 471 parts In-Stock

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$0.379

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471

$0.379

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Corphita

USA . 1,560 parts In-Stock

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$0.387

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1,560

$0.387

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Advanced Electronics

New Zealand . 37 parts In-Stock

1+ parts

$1.155

100+ parts

$1.097

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$1.097

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37

$1.155

$1.097

$1.097

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Aztec Data Supply Inc.

USA . 1,087 parts In-Stock

1+ parts

$1.880

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$1.880

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RC Electronics

USA . 72,657 parts In-Stock

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Kepictronics

USA . 34,660 parts In-Stock

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GreenTree Electronics

Israel . 22,500 parts In-Stock

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Lixinc

USA . 12,721 parts In-Stock

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Epart123

USA . 12,500 parts In-Stock

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$3.650

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$3.650

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$3.650

Problanco Electronics

Mexico . 8,192 parts In-Stock

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SupplyDigital Components

Austria . 8,114 parts In-Stock

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TANS Electronics

Latvia . 8,098 parts In-Stock

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Kulean Microsystems

USA . 7,446 parts In-Stock

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Continental Prestige Electronics

USA . 3,468 parts In-Stock

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Futuretech Components

Singapore . 2,480 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Authorized Procurement Solutions

USA . 2,380 parts In-Stock

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,192 parts In-Stock

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ChipstoGo Electronic ltd

UK . 710 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.483

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$0.468

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$0.458

100

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$0.468

$0.458

UHIMA Technologies

Türkiye . 76 parts In-Stock

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Overview

Discover the NTMS4177PR2G by Onsemi, a top-tier P-CHANNEL Small Signal Field Effect Transistor designed for high-performance switching applications. With a robust manufacturing process and cutting-edge technology, Onsemi delivers unparalleled quality and reliability. This versatile transistor offers customers the value of enhanced efficiency and optimal performance in a compact package. Whether you're looking to upgrade your electronics or enhance your project, the NTMS4177PR2G is the perfect choice for seamless integration and superior results. Experience the benefits of advanced semiconductor technology with Onsemi's NTMS4177PR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the transistor, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low power consumption and efficiency, making them ideal for switching applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and mounting in electronic circuits.

Maximum Drain Current (Abs) (ID): 8.9 A

High maximum drain current rating enables the transistor to handle more current flow, suitable for demanding applications.

Maximum Power Dissipation (Abs): 2.5 W

High power dissipation capability helps in preventing overheating and ensures reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in a compact size.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows the transistor to function effectively in different environmental conditions.

Maximum Drain-Source On Resistance: 0.012 ohm

Low on-resistance leads to minimal power loss and efficient switching performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS4177PR2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

8.9 A

Maximum Drain Current (ID):

6.6 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS4177PR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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