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NDS332P

Onsemi

NDS332P by Onsemi

NDS332P by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage, 1A max drain current, and 0.3 ohm max on resistance. Ideal for switching applications, it features a built-in diode in a small outline package suitable for surface mount technology. Operating at up to 150°C, this MOSFET is designed for enhancement mode operation.

Median Price

$0.236

Lifecycle Status

Suppliers In-Stock

53

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

$0.167

100+ parts

$0.159

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$0.159

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1,000

$0.167

$0.159

$0.159

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Arrow

USA . 2,335 parts In-Stock

1+ parts

$0.202

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$0.135

2,335

$0.202

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$0.135

Farnell

UK . 11,734 parts In-Stock

1+ parts

$0.358

100+ parts

$0.118

1k+ parts

$0.090

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11,734

$0.358

$0.118

$0.090

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Distrelec

Netherlands . 14,983 parts In-Stock

1+ parts

$0.404

100+ parts

$0.317

1k+ parts

$0.251

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14,983

$0.404

$0.317

$0.251

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Element14

Singapore . 6,760 parts In-Stock

1+ parts

$0.707

100+ parts

$0.233

1k+ parts

$0.178

10k+ parts

$0.139

6,760

$0.707

$0.233

$0.178

$0.139

Newark

USA . 168 parts In-Stock

1+ parts

$0.752

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$0.303

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$0.205

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168

$0.752

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DigiKey

USA . 103,337 parts In-Stock

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$0.790

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$0.314

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$0.215

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$0.790

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Mouser Electronics

USA . 34,342 parts In-Stock

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$0.790

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$0.315

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$0.790

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Future Electronics

Canada . 345,000 parts In-Stock

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Verical

USA . 72,000 parts In-Stock

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Master Electronics

USA . 36,000 parts In-Stock

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Rochester

USA . 32,816 parts In-Stock

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$0.177

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$0.131

Chip1Stop

Japan . 2,725 parts In-Stock

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$0.269

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$0.127

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RS (Exports)

UK . 1,870 parts In-Stock

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$0.162

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$0.141

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Distributors (In-Stock)

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Digiode

USA . 1,646 parts In-Stock

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$0.138

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TEDSS.com

USA . 1,486 parts In-Stock

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$0.150

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$0.150

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Nova Conductors

Japan . 92 parts In-Stock

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$0.289

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Component Electronics Inc.

Canada . 8,594 parts In-Stock

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$0.380

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Bristol Electronics

USA . 9,761 parts In-Stock

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$0.675

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$0.135

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9,761

$0.675

$0.338

$0.135

$0.084

TME

Poland . 1,635 parts In-Stock

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$0.740

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$0.297

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Maritex

Poland . 467 parts In-Stock

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$0.950

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467

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NAC Semi

USA . 4,788,000 parts In-Stock

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Component Sense

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IBS Electronics

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Cyclops Electronics Ltd

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Electronics Depot

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Goldney Electronics S.L.

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M&R Communications

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Whistler Technology

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Holdelec - ElecDif-Pro

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ComSIT Distribution GmbH

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Pegasus Components GmbH

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Netsource Technology, Inc.

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Sea View Technologies

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Rebound Electronics

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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Semi Source

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Flex Direct, LLC

USA . 374 parts In-Stock

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Sensible Micro Corp

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Prism Electronics

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PC Components Company LLC

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Semicontronic

India . 87,967 parts In-Stock

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$0.099

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$0.097

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$0.096

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Ampacity Inc.

Singapore . 82,475 parts In-Stock

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Corohmni

South Africa . 71 parts In-Stock

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Corphita

USA . 2,765 parts In-Stock

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Component Stockers USA

USA . 150,981 parts In-Stock

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$0.170

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$0.167

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$0.159

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Continental Prestige Electronics

USA . 4,820 parts In-Stock

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$0.253

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$0.248

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Argo Parts USA

USA . 3,085 parts In-Stock

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$0.253

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$0.245

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$0.253

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Bastille Electronics

Australia . 300 parts In-Stock

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$0.289

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$0.275

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$0.261

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$0.257

300

$0.289

$0.275

$0.261

$0.257

Aztec Data Supply Inc.

USA . 3,280 parts In-Stock

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$1.454

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Perfect Parts

USA . 131,422 parts In-Stock

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RC Electronics

USA . 94,506 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 24,000 parts In-Stock

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iodParts Technologies Inc.

India . 22,050 parts In-Stock

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USA . 19,784 parts In-Stock

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GreenTree Electronics

Israel . 18,000 parts In-Stock

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Authorized Procurement Solutions

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Brazil . 6,054 parts In-Stock

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Lucentia Tech

USA . 6,054 parts In-Stock

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Overview

Discover the NDS332P by Onsemi, a top-quality P-CHANNEL Small Signal Field Effect Transistor designed for switching applications. With a maximum drain current of 1 A and a low on-resistance of 0.3 ohm, this transistor offers reliable performance in a compact package. Manufactured by Onsemi, known for their commitment to excellence in semiconductor technology, the NDS332P provides exceptional value and efficiency for your electronic projects. Whether you're designing consumer electronics, automotive systems, or industrial equipment, this transistor is sure to meet your needs with its enhanced mode operation and built-in diode configuration. Experience the benefits of superior performance with the NDS332P from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low power consumption and high efficiency, making this product a great choice for power-sensitive applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this transistor simplifies circuit design and reduces the need for additional components, making it a convenient choice.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast switching speeds and high efficiency, making it suitable for a wide range of electronic devices.

Surface Mount: YES

With surface mount capability, this transistor can be easily mounted onto circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 20 V

The high minimum breakdown voltage ensures reliable operation and protection against voltage spikes, making this transistor a dependable choice.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement on circuit boards and efficient use of space, making it a practical choice for compact designs.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder connections and easy installation, ensuring stable performance in various applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control over the transistor's conductivity, making it suitable for a wide range of voltage levels and applications.

Maximum Drain Current (Abs) (ID): 1 A

With a high maximum drain current, this transistor can handle heavy loads and high power applications reliably, making it a versatile choice.

No. of Terminals: 3

The three terminals provide flexibility in circuit design and connectivity options, allowing for custom configurations and versatile usage.

Maximum Power Dissipation (Abs): 0.5 W

The high maximum power dissipation capability ensures efficient heat dissipation and reliable performance in demanding conditions, making this transistor a durable choice.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for compact designs, making this transistor suitable for portable electronics and tight layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high switching speeds and low power consumption, making this transistor energy-efficient and reliable in various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without compromising performance, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high conductivity and reliability, making this transistor a durable and long-lasting choice.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring secure connections and long-term reliability in various environments.

Maximum Drain-Source On Resistance: 0.3 ohm

The low maximum drain-source on resistance minimizes power loss and heat dissipation, making this transistor efficient and reliable in high-power applications.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connection options, making this transistor versatile and easy to integrate into different circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures safe and efficient soldering processes, preventing damage to the transistor and ensuring reliable performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering in demanding conditions, making this transistor suitable for high-temperature environments and manufacturing processes.

Technical Specifications

Small Signal Field Effect Transistors (FET) NDS332P attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, ESD RATED

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDS332P Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-546-9049, 5961015469049

NIIN

015469049

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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