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NDS356AP

Onsemi

NDS356AP by Onsemi

NDS356AP by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 1.1A, 0.2 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. This SMALL OUTLINE transistor has a max Power Dissipation of 0.5W and can withstand temperatures from -55 to 150 °C.

Median Price

$0.176

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1k+

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Flip Electronics (Authorized)

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Element14

Singapore . 387 parts In-Stock

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TEDSS.com

USA . 4,560 parts In-Stock

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Nova Conductors

Japan . 82 parts In-Stock

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American Microsemiconductor Inc.

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Maritex

Poland . 202 parts In-Stock

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Singapore . 5,650 parts In-Stock

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Corohmni

South Africa . 235 parts In-Stock

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Argo Parts USA

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Aztec Data Supply Inc.

USA . 2,700 parts In-Stock

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Brazil . 19,763 parts In-Stock

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Lucentia Tech

USA . 19,763 parts In-Stock

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Microchip USA

USA . 9,759 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

Latvia . 5,889 parts In-Stock

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Computer Components Inc. - USA

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Component Stockers USA

USA . 771 parts In-Stock

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UHIMA Technologies

Türkiye . 755 parts In-Stock

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Singapore . 670 parts In-Stock

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Overview

Experience the superior performance of the NDS356AP P-CHANNEL FET by Onsemi, a top-tier manufacturer known for its high-quality components. This versatile transistor is ideal for switching applications and offers a built-in diode for added convenience. With a maximum drain current of 1.1A and low on-resistance, this transistor delivers reliable operation and efficient power dissipation. Whether you're designing consumer electronics, automotive systems, or industrial controls, the NDS356AP provides the value, benefits, and advantages you need to bring your projects to life. Trust in Onsemi for cutting-edge technology and exceptional quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-state resistance and high current carrying capability, making them suitable for efficient switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the transistor from reverse polarity voltage spikes, enhancing its reliability and longevity.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency.

Maximum Drain-Source On Resistance: 0.2 ohm

The low on-resistance of 0.2 ohm ensures minimal power loss and high efficiency in the circuit.

Maximum Drain Current (ID): 1.1 A

With a maximum drain current of 1.1 A, this transistor can handle moderate to high current loads effectively.

Maximum Power Dissipation (Abs): 0.5 W

The maximum power dissipation of 0.5 W allows the transistor to operate reliably under varying load conditions without overheating.

Maximum Operating Temperature: 150 °C

The wide operating temperature range of up to 150°C makes this transistor suitable for use in various environments and applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NDS356AP attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.1 A

Maximum Drain Current (ID):

1.1 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDS356AP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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