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NTMS4704NR2

Onsemi

NTMS4704NR2 by Onsemi

NTMS4704NR2 by Onsemi is a N-CHANNEL FET with 30V DS breakdown voltage, 7.6A max drain current, and 0.0095 ohm max on resistance. It is used for switching applications in enhancement mode, featuring a built-in diode and GULL WING terminals for surface mount assembly.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 17,000 parts In-Stock

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USA . 594 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,451 parts In-Stock

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Problanco Electronics

Mexico . 5,376 parts In-Stock

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SupplyDigital Components

Austria . 4,579 parts In-Stock

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TANS Electronics

Latvia . 1,672 parts In-Stock

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Kulean Microsystems

USA . 446 parts In-Stock

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UHIMA Technologies

Türkiye . 340 parts In-Stock

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Corohmni

South Africa . 316 parts In-Stock

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Overview

Enhance your electronic projects with the NTMS4704NR2 by Onsemi, a top-quality Small Signal Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is ideal for switching applications. With its built-in diode and low on-resistance, this transistor provides exceptional value and efficiency. Upgrade your designs today with the NTMS4704NR2 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Suitable for applications requiring an N-channel transistor, offering versatility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient for switch applications where a built-in diode is needed for protection or reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

Provides a suitable breakdown voltage for various voltage requirements in applications, ensuring robust performance.

Package Shape: RECTANGULAR

Offers a compact and space-efficient design for easy integration into circuit layouts.

Terminal Form: GULL WING

Enables secure and reliable connections during installation, reducing the risk of disconnection or signal interference.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors allow for easier control of the switching operation, improving overall circuit efficiency.

No. of Terminals: 8

Provides multiple terminal connections for versatile circuit configurations and interface options.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the circuit board, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers a reliable and high-performance transistor technology known for its efficiency and low power consumption.

Transistor Element Material: SILICON

Silicon-based transistors provide stable performance over a wide range of operating conditions, ensuring reliability.

Terminal Finish: TIN LEAD

Provides a durable and corrosion-resistant finish on the terminals, ensuring long-term reliability and signal integrity.

Maximum Drain Current (ID): 7.6 A

With a high maximum drain current, this transistor can handle high loads and current requirements in demanding applications.

Maximum Drain-Source On Resistance: 0.0095 ohm

Low on-resistance ensures minimal power loss and efficient performance in switching applications, improving overall circuit efficiency.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options, allowing for various circuit configurations and interfaces.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during assembly processes, ensuring proper soldering and reliable connections.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS4704NR2 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.0095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS4704NR2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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