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NTGS5120PT1G

Onsemi

NTGS5120PT1G by Onsemi

NTGS5120PT1G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a single configuration with built-in diode, GULL WING terminals, and operates in ENHANCEMENT MODE. With a max ID of 2.5A and 0.111 ohm RDS(on), it offers high performance in a small outline package style.

Median Price

$0.219

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

$0.220

100+ parts

$0.220

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$0.210

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3,000

$0.220

$0.220

$0.210

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Mouser Electronics

USA . 28,771 parts In-Stock

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$0.820

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$0.358

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$0.231

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$0.185

28,771

$0.820

$0.358

$0.231

$0.185

DigiKey

USA . 24,087 parts In-Stock

1+ parts

$0.820

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$0.329

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$0.226

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24,087

$0.820

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Future Electronics

Canada . 399,000 parts In-Stock

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Arrow

USA . 24,000 parts In-Stock

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Verical

USA . 24,000 parts In-Stock

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Master Electronics

USA . 18,000 parts In-Stock

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$0.134

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$0.127

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Element14

Singapore . 3,550 parts In-Stock

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$0.396

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$0.281

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$0.276

3,550

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$0.281

$0.276

Farnell

UK . 3,015 parts In-Stock

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$0.219

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$0.176

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$0.149

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$0.219

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$0.149

Chip1Stop

Japan . 2,770 parts In-Stock

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$0.168

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$0.143

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$0.132

2,770

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$0.168

$0.143

$0.132

RS (Exports)

UK . 2,375 parts In-Stock

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$0.473

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$0.268

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$0.221

2,375

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$0.473

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Distributors (In-Stock)

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Digiode

USA . 775 parts In-Stock

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$0.209

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$0.209

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Nova Conductors

Japan . 700 parts In-Stock

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$0.267

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700

$0.267

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Bristol Electronics

USA . 667 parts In-Stock

1+ parts

$0.750

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$0.375

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$0.263

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667

$0.750

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$0.263

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IBS Electronics

USA . 702,000 parts In-Stock

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$0.213

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NAC Semi

USA . 507,000 parts In-Stock

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Chip Stock

USA . 95,480 parts In-Stock

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Vyrian

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Extreme Components

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Martec Srl

Italy . 5,698 parts In-Stock

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Avant Electronics Limited

UK . 3,000 parts In-Stock

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Flip Electronics

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Sensible Micro Corp

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Cyclops Electronics Ltd

UK . 2,795 parts In-Stock

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Semi Source

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Microfarads

USA . 154 parts In-Stock

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LWI Electronics Inc

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ComSIT USA

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Distributors (Availability)

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Ampacity Inc.

Singapore . 33,889 parts In-Stock

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$0.124

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Corohmni

South Africa . 452 parts In-Stock

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$0.146

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Corphita

USA . 1,895 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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$0.262

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$0.251

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100

$0.262

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$0.251

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Continental Prestige Electronics

USA . 5,639 parts In-Stock

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$0.267

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$0.262

5,639

$0.267

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$0.262

Argo Parts USA

USA . 578 parts In-Stock

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$0.267

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$0.259

578

$0.267

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$0.259

Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.719

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$0.683

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$0.683

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40

$0.719

$0.683

$0.683

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Modulus Dynamics

Lithuania . 9,282 parts In-Stock

1+ parts

$1.387

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$1.387

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$1.387

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9,282

$1.387

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$1.387

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Aztec Data Supply Inc.

USA . 449 parts In-Stock

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$1.810

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Perfect Parts

USA . 361,970 parts In-Stock

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Eastek

USA . 105,000 parts In-Stock

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$0.390

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RC Electronics

USA . 50,387 parts In-Stock

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Computer Components Inc. - USA

USA . 27,000 parts In-Stock

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Assy Fe

Spain . 16,355 parts In-Stock

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Kulean Microsystems

USA . 8,087 parts In-Stock

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Futuretech Components

Singapore . 7,000 parts In-Stock

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USA . 6,505 parts In-Stock

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Benley Electronics

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Problanco Electronics

Mexico . 5,562 parts In-Stock

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SupplyDigital Components

Austria . 4,137 parts In-Stock

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S.R.D Solutions

India . 4,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,988 parts In-Stock

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Kepictronics

USA . 1,299 parts In-Stock

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TANS Electronics

Latvia . 1,295 parts In-Stock

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UHIMA Technologies

Türkiye . 325 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$6.450

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$6.450

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$6.450

200

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$6.450

$6.450

$6.450

Overview

Enhance your electronic projects with the NTGS5120PT1G P-channel field-effect transistor by Onsemi. This high-quality component offers reliable switching capabilities, making it ideal for a wide range of applications. With a maximum power dissipation of 1.1W and a minimum DS breakdown voltage of 60V, this transistor is designed to deliver superior performance while maximizing efficiency. Whether you're working on DIY electronics or professional projects, the NTGS5120PT1G is sure to meet your needs with its built-in diode and enhancement mode operation. Upgrade your circuits today with this versatile and dependable component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where P-channel transistors are preferred or required.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with a built-in diode for certain circuit configurations.

Transistor Application: SWITCHING

Ideal for switching applications due to its intended purpose and design.

Surface Mount: YES

Easy to mount on PCBs, making installation and assembly more efficient.

Minimum DS Breakdown Voltage: 60 V

Suitable for applications requiring a minimum breakdown voltage of 60V.

Package Shape: RECTANGULAR

Compact shape that saves space on the PCB and allows for efficient placement.

Terminal Form: GULL WING

Provides a secure and stable connection to the PCB for reliable performance.

Operating Mode: ENHANCEMENT MODE

Improved efficiency and control in enhancement mode operation.

Maximum Drain Current (Abs) (ID): 2.5 A

Capable of handling high drain currents for power-efficient operation.

No. of Terminals: 6

Provides multiple connection points for flexibility in circuit design.

Maximum Power Dissipation (Abs): 1.1 W

Can dissipate power efficiently to prevent overheating and ensure reliability.

Package Style (Meter): SMALL OUTLINE

Compact package style that saves space and allows for dense PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for improved performance and efficiency.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance or reliability.

Transistor Element Material: SILICON

Utilizes silicon material known for its reliability and performance in transistors.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a durable finish for the terminals, ensuring long-term performance.

Maximum Drain-Source On Resistance: 0.111 ohm

Low on-resistance for efficient power transfer and reduced heat dissipation.

Terminal Position: DUAL

Allows for easy connectivity and flexibility in circuit design.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for a specified duration without damage.

Peak Reflow Temperature °C: 260

Suitable for reflow soldering processes at high temperatures for PCB assembly.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTGS5120PT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

1.8 A

Maximum Drain-Source On Resistance:

.111 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTGS5120PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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