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NTGS4111PT1G

Onsemi

NTGS4111PT1G by Onsemi

NTGS4111PT1G by Onsemi is a P-CHANNEL FET with 30V DS breakdown voltage and 3.7A max drain current. Ideal for switching applications, it features a built-in diode, operates in enhancement mode, and has a low on-resistance of 0.06 ohm.

Median Price

$0.207

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Mouser Electronics

USA . 6,767 parts In-Stock

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$0.850

100+ parts

$0.354

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$0.271

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$0.354

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Arrow

USA . 90,000 parts In-Stock

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$0.159

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Verical

USA . 90,000 parts In-Stock

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DigiKey

USA . 15,015 parts In-Stock

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Newark

USA . 9,000 parts In-Stock

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Future Electronics

Canada . 3,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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Rochester

USA . 2,622 parts In-Stock

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$0.207

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2,622

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Farnell

UK . 1,185 parts In-Stock

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$0.281

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$0.193

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$0.281

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Element14

Singapore . 1,185 parts In-Stock

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$0.480

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$0.330

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$0.324

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Chip1Stop

Japan . 7 parts In-Stock

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Vyrian

USA . 1,920 parts In-Stock

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Digiode

USA . 1,185 parts In-Stock

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Bristol Electronics

USA . 1,427 parts In-Stock

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$0.762

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$0.381

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$0.152

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1,427

$0.762

$0.381

$0.152

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Component Electronics Inc.

Canada . 1,185 parts In-Stock

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$1.150

100+ parts

$0.870

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$0.750

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$1.150

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Chip Stock

USA . 132,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 29,757 parts In-Stock

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IBS Electronics

USA . 12,000 parts In-Stock

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$0.164

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Flip Electronics

USA . 6,000 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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Sensible Micro Corp

USA . 2,634 parts In-Stock

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A&K Electronics

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Rotakorn

Sweden . 2,261 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,427 parts In-Stock

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Dan-Mar Components

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Nova Conductors

Japan . 450 parts In-Stock

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A2Z Electronics, Inc.

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Technoshack Inc.

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Ampacity Inc.

Singapore . 13,072 parts In-Stock

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$0.104

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Corohmni

South Africa . 85 parts In-Stock

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Corphita

USA . 1,661 parts In-Stock

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Benley Electronics

USA . 5 parts In-Stock

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$0.750

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$0.750

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$0.832

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$0.757

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$0.682

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$0.832

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Perfect Parts

USA . 656,688 parts In-Stock

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GreenTree Electronics

Israel . 363,000 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Eastek

USA . 60,000 parts In-Stock

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Authorized Procurement Solutions

USA . 36,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,380 parts In-Stock

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iodParts Technologies Inc.

India . 13,675 parts In-Stock

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Lixinc

USA . 11,093 parts In-Stock

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Argo Parts USA

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Kulean Microsystems

USA . 4,970 parts In-Stock

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SupplyDigital Components

Austria . 4,842 parts In-Stock

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Problanco Electronics

Mexico . 3,883 parts In-Stock

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Kepictronics

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Infinite Electronics LLP (Excess)

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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S.R.D Solutions

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TANS Electronics

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Aranea Global

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Assy Fe

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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Continental Prestige Electronics

USA . 686 parts In-Stock

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Futuretech Components

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Overview

Discover the NTGS4111PT1G by Onsemi, a top-of-the-line Small Signal Field Effect Transistor that boasts unparalleled quality and reliability. Manufactured by Onsemi, a trusted industry leader, this P-CHANNEL transistor with built-in diode is perfect for switching applications. With its compact size, high power dissipation, and low drain-source on resistance, this transistor offers exceptional performance and efficiency. Whether you're looking to enhance your electronic devices or improve your project, the NTGS4111PT1G provides unmatched value and benefits. Upgrade your technology today with this cutting-edge field effect transistor from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the transistor lightweight and durable, ideal for use in various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their high efficiency and low power consumption, making this product energy-efficient.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB, making it a cost-effective choice.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can quickly turn on and off, making it suitable for a wide range of electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages, ensuring reliability in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the flow of current, enhancing overall performance and efficiency.

Maximum Drain Current (Abs) (ID): 3.7 A

Capable of handling high current loads, this transistor is suitable for power applications that require a robust performance.

Maximum Power Dissipation (Abs): 0.63 W

With a high power dissipation rating, this transistor can effectively dissipate heat, ensuring stable operation under heavy loads.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows this transistor to be used in extreme thermal conditions without compromising its performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTGS4111PT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.7 A

Maximum Drain Current (ID):

3.7 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTGS4111PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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