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NTGS3443T2G

Onsemi

NTGS3443T2G by Onsemi

NTGS3443T2G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage and 2.2A ID. Ideal for SWITCHING applications, it features 0.065 ohm RDS(ON) and operates in ENHANCEMENT MODE. This SMALL OUTLINE transistor has GULL WING terminals and a built-in DIODE for efficient performance.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 574,753 parts In-Stock

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Rochester

USA . 3,000 parts In-Stock

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-

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$0.132

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$0.110

10k+ parts

$0.098

3,000

-

$0.132

$0.110

$0.098

Verical

USA . 3,000 parts In-Stock

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$0.122

3,000

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$0.122

Distributors (In-Stock)

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Digiode

USA . 621 parts In-Stock

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$0.103

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621

$0.103

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Flip Electronics

USA . 574,753 parts In-Stock

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574,753

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Vyrian

USA . 6,897 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 288,395 parts In-Stock

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$0.092

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288,395

$0.092

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Corphita

USA . 1,277 parts In-Stock

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$0.097

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Corohmni

South Africa . 461 parts In-Stock

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$0.108

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461

$0.108

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Component Stockers USA

USA . 1,904 parts In-Stock

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$0.110

100+ parts

$0.100

1k+ parts

$0.090

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1,904

$0.110

$0.100

$0.090

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AZTECH Wire

Italy . 1,015 parts In-Stock

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$15.060

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$15.060

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Kepictronics

USA . 18,578 parts In-Stock

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TANS Electronics

Latvia . 6,589 parts In-Stock

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SupplyDigital Components

Austria . 6,360 parts In-Stock

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Kulean Microsystems

USA . 5,828 parts In-Stock

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Problanco Electronics

Mexico . 4,657 parts In-Stock

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UHIMA Technologies

Türkiye . 107 parts In-Stock

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Overview

Enhance your electronics projects with the NTGS3443T2G by Onsemi, a top-quality P-CHANNEL Small Signal Field Effect Transistor (FET) that offers reliable switching capabilities. Onsemi is known for their cutting-edge technology and dedication to excellence in semiconductor manufacturing. This transistor is ideal for a wide range of applications and comes in a convenient surface mount package with built-in diode. Experience the benefits of enhanced performance and efficiency with the NTGS3443T2G, a valuable component that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

Suitable for applications requiring P-channel transistors, providing versatility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a built-in diode, reducing the need for additional components.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring efficient performance in such scenarios.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving assembly time.

Minimum DS Breakdown Voltage: 20 V

Provides a safe operating margin for the transistor in various applications.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit designs with its standard rectangular shape.

No. of Terminals: 6

Offers multiple connection points for flexibility in circuit layout and design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for efficient and reliable performance.

Transistor Element Material: SILICON

Provides high reliability and performance characteristics, common in modern semiconductor devices.

Maximum Drain Current (ID): 2.2 A

Capable of handling higher current loads, making it suitable for a variety of applications.

Maximum Drain-Source On Resistance: 0.065 ohm

Low on-resistance ensures minimal power loss and efficient operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTGS3443T2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA LOW RESISTANCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.2 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTGS3443T2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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