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NTGS4111PT2G

Onsemi

NTGS4111PT2G by Onsemi

NTGS4111PT2G by Onsemi is a P-CHANNEL FET with 30V DS breakdown voltage and 2.6A max drain current. Ideal for switching applications, it features a 0.06 ohm on resistance and operates in enhancement mode. This small outline transistor has 6 terminals, GULL WING form, and built-in diode for efficient performance.

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1k+

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Vyrian

USA . 4,690 parts In-Stock

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Digiode

USA . 1,632 parts In-Stock

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AZTECH Wire

Italy . 431 parts In-Stock

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Component Stockers USA

USA . 539 parts In-Stock

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$99.990

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Kepictronics

USA . 18,985 parts In-Stock

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Kulean Microsystems

USA . 7,890 parts In-Stock

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TANS Electronics

Latvia . 4,359 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

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SupplyDigital Components

Austria . 1,266 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 540 parts In-Stock

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Corohmni

South Africa . 283 parts In-Stock

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Overview

Upgrade your electronic projects with the NTGS4111PT2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Small Signal Field Effect Transistors that offer unparalleled performance and reliability. Ideal for switching applications, this P-channel transistor features a built-in diode for added convenience. With a low drain-source on resistance and high drain current capacity, this enhancement mode transistor ensures efficient operation. Experience the value and benefits of the NTGS4111PT2G in your next project and elevate your electronics to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the transistor, ensuring longevity and ease of handling.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where high speed switching is required, making this transistor ideal for various electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers protection against reverse current flow, enhancing the reliability of the transistor in circuitry.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficiency and precision in controlling current flow.

Surface Mount: YES

Easily mountable on circuit boards, simplifying installation and reducing overall size of the electronic assembly.

Minimum DS Breakdown Voltage: 30 V

Can withstand up to 30 volts, making it suitable for a variety of low to medium voltage applications.

Package Shape: RECTANGULAR

Compact rectangular shape saves space and allows for efficient placement on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering points and easy assembly, ensuring a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control of the transistor's conductivity, enabling efficient switching performance.

No. of Terminals: 6

Sufficient number of terminals for versatile connectivity options in various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design saves space and facilitates easy integration into electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliability in low power consumption applications.

Transistor Element Material: SILICON

Silicon material provides high thermal conductivity and durability, ensuring stable performance under various operating conditions.

Terminal Finish: TIN

Tin finish offers excellent solderability and corrosion resistance for long-term reliability in electronic assemblies.

Maximum Drain Current (ID): 2.6 A

Capable of handling a maximum drain current of 2.6 amps, making it suitable for a wide range of applications requiring moderate power usage.

Maximum Drain-Source On Resistance: 0.06 ohm

Low drain-source on resistance enables efficient current flow and minimizes power loss in circuit operation.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options, offering flexibility in circuit design and layout.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperature for 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures secure solder joints and reliable performance in demanding environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTGS4111PT2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTGS4111PT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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