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NTGS4141NT1

Onsemi

NTGS4141NT1 by Onsemi

NTGS4141NT1 by Onsemi is a N-CHANNEL FET with 30V DS breakdown voltage, ideal for SWITCHING applications. It features a max ID of 5A and 0.025 ohm RDS(on), operating in ENHANCEMENT MODE at up to 150 °C. This small outline transistor with GULL WING terminals is designed for surface mount installation.

Median Price

$0.338

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 3,000 parts In-Stock

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-

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$0.338

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$0.135

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$0.101

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$0.338

$0.135

$0.101

Digiode

USA . 1,276 parts In-Stock

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Vyrian

USA . 73 parts In-Stock

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Kepictronics

USA . 66,000 parts In-Stock

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Metaverse IC Inc.

Canada . 60,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,952 parts In-Stock

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Kulean Microsystems

USA . 3,072 parts In-Stock

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Corphita

USA . 2,388 parts In-Stock

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SupplyDigital Components

Austria . 1,463 parts In-Stock

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TANS Electronics

Latvia . 1,164 parts In-Stock

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Problanco Electronics

Mexico . 405 parts In-Stock

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Corohmni

South Africa . 173 parts In-Stock

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UHIMA Technologies

Türkiye . 116 parts In-Stock

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Overview

Enhance your electronic projects with the NTGS4141NT1 by Onsemi, a superior quality Small Signal Field Effect Transistor designed for switching applications. With a single configuration and built-in diode, this N-CHANNEL FET offers reliability and efficiency. Its compact design and high power dissipation make it ideal for a wide range of applications. Experience the benefits of enhanced performance and durability with the NTGS4141NT1, delivering value and innovation to customers seeking top-notch components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with an integrated diode for specific circuit requirements.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 30 V

Withstands high voltage levels, making it suitable for a variety of applications.

Surface Mount: YES

Easily mountable on PCBs, saving space and providing efficient circuit layouts.

Maximum Drain Current (Abs) (ID): 5 A

Capable of handling high current levels, suitable for demanding applications.

Maximum Power Dissipation (Abs): 2 W

Efficient power dissipation capabilities, ensuring stable operation under load.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable and high-performance technology for optimal transistor functionality.

Maximum Operating Temperature: 150 °C

Can operate efficiently at elevated temperatures, suitable for various environments.

Transistor Element Material: SILICON

Silicon-based material provides reliable performance and durability.

Maximum Drain-Source On Resistance: 0.025 ohm

Low on-resistance ensures efficient current flow and minimal power loss.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during manufacturing processes without damage.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTGS4141NT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTGS4141NT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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