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2N7002W

Onsemi

2N7002W by Onsemi

Onsemi's 2N7002W is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Package includes GULL WING terminals in a RECTANGULAR shape for surface mount assembly at temperatures up to 150°C.

Median Price

$0.071

Lifecycle Status

Suppliers In-Stock

40

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1k+

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Distrelec

Netherlands . 5,530 parts In-Stock

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$0.033

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Rochester

USA . 3,000 parts In-Stock

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$0.054

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Adafruit Industries

USA . 200 parts In-Stock

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Newark

USA . 625 parts In-Stock

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$0.389

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DigiKey

USA . 615,520 parts In-Stock

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Mouser Electronics

USA . 38,849 parts In-Stock

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Verical

USA . 143,036 parts In-Stock

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Arrow

USA . 48,000 parts In-Stock

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Master Electronics

USA . 36,000 parts In-Stock

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Element14

Singapore . 6,350 parts In-Stock

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Chip1Stop

Japan . 3,369 parts In-Stock

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Digiode

USA . 2,870 parts In-Stock

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DF Sales Co.

USA . 1,930 parts In-Stock

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Bristol Electronics

USA . 41,642 parts In-Stock

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Maritex

Poland . 2,146 parts In-Stock

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TME

Poland . 143,036 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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TEDSS.com

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NAC Semi

USA . 6,000 parts In-Stock

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ComSIT Distribution GmbH

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Prism Electronics

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Semi Source

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NPI Materials, Inc.

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Semicontronic

India . 25,148 parts In-Stock

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Ampacity Inc.

Singapore . 15,811 parts In-Stock

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Corohmni

South Africa . 438 parts In-Stock

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Corphita

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Argo Parts USA

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Continental Prestige Electronics

USA . 10,985 parts In-Stock

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Aztec Data Supply Inc.

USA . 943 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Eastek

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Israel . 9,000 parts In-Stock

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Spain . 8,070 parts In-Stock

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Authorized Procurement Solutions

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Mexico . 6,492 parts In-Stock

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USA . 6,137 parts In-Stock

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Component Stockers USA

USA . 2,478 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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SupplyDigital Components

Austria . 1,016 parts In-Stock

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Overview

Enhance your electronic devices with the superior quality and performance of the 2N7002W by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch small signal field effect transistors that are ideal for switching applications. With its N-channel polarity, single configuration with built-in diode, and high DS breakdown voltage of 60V, this transistor ensures reliable and efficient operation. Experience the benefits of enhanced mode operation, low on-resistance, and high power dissipation for optimal performance. Trust Onsemi to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for switching applications due to their efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect against reverse polarity or voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages, increasing its versatility in different circuits.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor for easy mounting and compatibility with various systems.

Terminal Form: GULL WING

Gull wing terminals facilitate soldering and connection, ensuring a secure and reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer precise control over the conductivity of the channel, improving efficiency in switching applications.

Maximum Drain Current (Abs) (ID): 0.115 A

Capable of handling up to 0.115 A of current, suitable for low to medium power applications.

No. of Terminals: 3

Having 3 terminals allows for easy integration into circuit designs and provides flexibility in connectivity.

Maximum Power Dissipation (Abs): 0.2 W

With a power dissipation of 0.2 W, this FET can handle moderate power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the circuit board, ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it suitable for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high temperatures in demanding environments.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material, offering good performance and stability in electronic devices.

Terminal Finish: MATTE TIN

Matte tin finish on terminals ensures good solderability and corrosion resistance, prolonging the lifespan of the FET.

Maximum Drain-Source On Resistance: 7.5 ohm

Low on-resistance ensures minimal power loss and efficient switching behavior in the FET.

Terminal Position: DUAL

Dual terminal position enables flexible mounting options and ease of connection in a circuit.

Maximum Time At Peak Reflow Temperature (s): 30

With a peak reflow temperature duration of 30 seconds, the FET can withstand the soldering process without damage.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and reliability of the connections.

Maximum Feedback Capacitance (Crss): 7 pF

Low feedback capacitance minimizes signal distortion and interference, improving the overall performance of the FET in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N7002W attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.115 A

Maximum Drain Current (ID):

.115 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N7002W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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