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BSS123LT3

Onsemi

BSS123LT3 by Onsemi

BSS123LT3 by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A max drain current, and 6 ohm max on resistance. Ideal for switching applications, it features a single configuration with built-in diode in a small outline package suitable for surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,268 parts In-Stock

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2,268

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VNN

France . 918 parts In-Stock

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918

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Vyrian

USA . 675 parts In-Stock

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675

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Nova Conductors

Japan . 90 parts In-Stock

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90

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 159 parts In-Stock

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$0.874

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159

$0.874

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Advanced Electronics

New Zealand . 51 parts In-Stock

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$1.816

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$1.725

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$1.725

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51

$1.816

$1.725

$1.725

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Ampacity Inc.

Singapore . 1,065 parts In-Stock

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$8.050

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1,065

$8.050

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AZTECH Wire

Italy . 675 parts In-Stock

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$8.436

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675

$8.436

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Semicontronic

India . 351 parts In-Stock

1+ parts

$12.050

100+ parts

$11.749

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$11.688

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351

$12.050

$11.749

$11.688

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Component Stockers USA

USA . 729 parts In-Stock

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$99.990

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729

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 23,439 parts In-Stock

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23,439

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Problanco Electronics

Mexico . 7,458 parts In-Stock

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Kulean Microsystems

USA . 6,491 parts In-Stock

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TANS Electronics

Latvia . 3,468 parts In-Stock

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Argo Parts USA

USA . 2,741 parts In-Stock

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2,741

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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806

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SupplyDigital Components

Austria . 731 parts In-Stock

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731

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Modulus Dynamics

Lithuania . 600 parts In-Stock

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600

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Corphita

USA . 441 parts In-Stock

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441

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Robosynatics

Brazil . 309 parts In-Stock

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$1.445

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$1.445

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$1.445

309

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$1.445

$1.445

$1.445

Lucentia Tech

USA . 309 parts In-Stock

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$1.445

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$1.445

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$1.445

309

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$1.445

$1.445

$1.445

Corohmni

South Africa . 199 parts In-Stock

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199

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Continental Prestige Electronics

USA . 2 parts In-Stock

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Overview

Enhance your electronic projects with the BSS123LT3 by Onsemi, a high-quality N-CHANNEL Field Effect Transistor with a single configuration and built-in diode. Ideal for switching applications, this transistor offers a maximum drain current of 0.17A and a minimum DS breakdown voltage of 100V. With its compact rectangular package body and surface-mount capability, the BSS123LT3 is perfect for space-constrained designs. Trust Onsemi's expertise in semiconductor technology to deliver reliable performance and lasting value. Elevate your circuits with the BSS123LT3 and experience enhanced efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel design allows for efficient power management and low on-resistance, making it suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency, making this transistor a cost-effective solution.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast operation and precise control, making it ideal for use in electronic devices.

Surface Mount: YES

The surface mount capability makes installation and integration easy, saving time and space in circuit board design.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can handle higher voltage levels, ensuring reliable performance under various conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and compact installation, making it suitable for small electronic devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure soldering and ensures a reliable connection in electronic circuits.

Operating Mode: ENHANCEMENT MODE

In enhancement mode, the transistor offers high gain and low on-resistance, providing efficient control and performance in switching applications.

Maximum Drain Current (Abs) (ID): 0.17 A

With a maximum drain current of 0.17 A, this transistor can handle moderate power loads, making it versatile for various applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123LT3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

.17 A

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS123LT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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