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BSS123LT1

Onsemi

BSS123LT1 by Onsemi

BSS123LT1 by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A max drain current, and 6 ohm max on resistance. Ideal for switching applications, this transistor operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

$1.902

Lifecycle Status

Suppliers In-Stock

50

In-Stock Inventory

1k+

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Adafruit Industries

USA . 1,000 parts In-Stock

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$1.902

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$1.807

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Component Electronics Inc.

Canada . 2,452 parts In-Stock

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Bristol Electronics

USA . 19,170 parts In-Stock

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American Microsemiconductor Inc.

USA . 11,980 parts In-Stock

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Digiode

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Corohmni

South Africa . 366 parts In-Stock

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$0.580

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Ampacity Inc.

Singapore . 933 parts In-Stock

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Semicontronic

India . 815 parts In-Stock

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$1.571

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Corphita

USA . 1,883 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,646 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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RC Electronics

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Perfect Parts

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Brazil . 5,000 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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Overview

Unlock the power of innovation with the BSS123LT1 by Onsemi. Crafted with precision and expertise, this small signal field-effect transistor offers unparalleled quality and reliability. Ideal for switching applications, this N-channel transistor boasts a single configuration with a built-in diode, providing seamless performance. With a maximum breakdown voltage of 100V and a low on-resistance of just 6 ohms, this transistor ensures efficient operation in a compact package. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the BSS123LT1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the transistor, making it durable and reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high input impedance and fast switching speeds, making them suitable for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse polarity protection and can help prevent damage to the transistor during operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Surface Mount: YES

Enables easy and efficient PCB assembly, making it suitable for automated mass production processes.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for high-power applications.

Maximum Drain Current (Abs): 0.17 A

Capable of handling moderate current levels, making it suitable for low to medium power applications.

Maximum Power Dissipation (Abs): 0.225 W

With a decent power dissipation rating, this FET can operate within its specified limits without overheating.

Maximum Operating Temperature: 150 °C

Capable of operating at relatively high temperatures, ensuring stable performance in various environmental conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers good performance characteristics in terms of switching speed and power efficiency, making it a reliable choice for switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123LT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

.17 A

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS123LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-574-1952, 5961015741952

NIIN

015741952

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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