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NTMS4404NR2G

Onsemi

NTMS4404NR2G by Onsemi

NTMS4404NR2G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 7A ID, and 0.0115 ohm RDS(ON). It is used for SWITCHING applications in ENHANCEMENT MODE. This RECTANGULAR package has GULL WING terminals and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

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1k+

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Digiode

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Austria . 7,131 parts In-Stock

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TANS Electronics

Latvia . 6,872 parts In-Stock

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Kulean Microsystems

USA . 6,059 parts In-Stock

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Problanco Electronics

Mexico . 3,968 parts In-Stock

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Corphita

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Corohmni

South Africa . 320 parts In-Stock

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UHIMA Technologies

Türkiye . 163 parts In-Stock

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Overview

Discover the NTMS4404NR2G by Onsemi, a game-changer in the world of Small Signal Field Effect Transistors. With a focus on quality and innovation, Onsemi has crafted a product that exceeds expectations in switching applications. This N-Channel transistor offers reliability and efficiency like no other, thanks to its built-in diode and enhancement mode operation. Say goodbye to performance issues with a maximum drain current of 7 A and a minimal drain-source on resistance of 0.0115 ohm. Experience the difference with the NTMS4404NR2G - where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for small signal FETs as it provides good insulation and protection for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in switching applications, making this transistor suitable for such purposes.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can provide protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance in this regard.

Surface Mount: YES

Surface mount technology allows for smaller footprint and higher component density on PCBs, making this transistor ideal for space-constrained designs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages than standard FETs, increasing its versatility.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle and install, making this transistor convenient for assembly.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints, ensuring reliability in the PCB assembly process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and easy control of the output, making this transistor suitable for various applications.

No. of Terminals: 8

Having 8 terminals allows for more connections and flexibility in circuit design, making this transistor versatile for different applications.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on the PCB and allow for high component density, making this transistor suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability in FETs, making this transistor a dependable choice for various applications.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistor elements, offering good performance and reliability in electronic circuits.

Maximum Drain Current (ID): 7 A

With a maximum drain current of 7A, this transistor can handle high power applications, making it suitable for various switching and amplification tasks.

Maximum Drain-Source On Resistance: 0.0115 ohm

Having a low on-resistance ensures minimal power loss and high efficiency in switching applications, making this transistor a reliable choice for power electronics.

Terminal Position: DUAL

Dual terminal position offers more flexibility in circuit design and layout, allowing for various connection possibilities in different applications.

Maximum Feedback Capacitance (Crss): 300 pF

Lower feedback capacitance reduces the risk of oscillations in high frequency circuits, improving stability and performance of the transistor in RF applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS4404NR2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.0115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

300 pF

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS4404NR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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