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NTMS10P02R2G

Onsemi

NTMS10P02R2G by Onsemi

The Onsemi NTMS10P02R2G is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max ID of 8.8A and 0.014 ohm Drain-Source Resistance, operating in ENHANCEMENT MODE at up to 150°C. This SMALL OUTLINE transistor has GULL WING terminals and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$0.718

Lifecycle Status

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30

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1k+

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Chip1Stop

Japan . 2,498 parts In-Stock

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$0.687

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$0.608

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$0.687

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Newark

USA . 2,938 parts In-Stock

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$2.130

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$0.922

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$0.694

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2,938

$2.130

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DigiKey

USA . 3,862 parts In-Stock

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$2.220

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$0.958

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$0.699

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3,862

$2.220

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Mouser Electronics

USA . 3,699 parts In-Stock

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$2.220

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$0.959

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$0.763

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3,699

$2.220

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Farnell

UK . 6,034 parts In-Stock

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$0.665

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$0.466

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$0.388

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Element14

Singapore . 6,034 parts In-Stock

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$1.230

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$0.852

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$0.796

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Rochester

USA . 3,305 parts In-Stock

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$0.748

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$0.621

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$0.554

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Future Electronics

Canada . 2,500 parts In-Stock

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Arrow

USA . 2,500 parts In-Stock

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Verical

USA . 2,500 parts In-Stock

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Flip Electronics (Authorized)

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Digiode

USA . 95 parts In-Stock

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Vyrian

USA . 188 parts In-Stock

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EXC GmbH

Germany . 2,400 parts In-Stock

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$0.708

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Bristol Electronics

USA . 2,717 parts In-Stock

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$0.583

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$0.409

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Chip Stock

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ComSIT Distribution GmbH

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Netsource Technology, Inc.

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NAC Semi

USA . 5,000 parts In-Stock

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Martec Srl

Italy . 4,026 parts In-Stock

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Dan-Mar Components

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IBS Electronics

USA . 2,500 parts In-Stock

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$0.842

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Pegasus Components GmbH

Germany . 900 parts In-Stock

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Cyclops Electronics Ltd

UK . 533 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Lantek

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Flex Direct, LLC

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LIBRA Elektronik GmbH

Germany . 49 parts In-Stock

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Prism Electronics

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Corphita

USA . 1,436 parts In-Stock

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$0.591

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Corohmni

South Africa . 498 parts In-Stock

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$0.649

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Component Stockers USA

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$0.750

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$0.710

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$0.640

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$0.750

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Benley Electronics

USA . 7 parts In-Stock

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Continental Prestige Electronics

USA . 7,880 parts In-Stock

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$1.070

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$0.777

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$0.530

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Microchip USA

USA . 3,855 parts In-Stock

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$4.993

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Perfect Parts

USA . 134,801 parts In-Stock

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Kepictronics

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Lixinc

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SupplyDigital Components

Austria . 5,626 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,910 parts In-Stock

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Authorized Procurement Solutions

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BidChips

USA . 4,026 parts In-Stock

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GreenTree Electronics

Israel . 4,026 parts In-Stock

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iBuyXS LLC

. 4,026 parts In-Stock

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$0.870

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Speed Components Ltd (Excess)

Israel . 4,026 parts In-Stock

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Kulean Microsystems

USA . 3,124 parts In-Stock

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TANS Electronics

Latvia . 2,995 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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Problanco Electronics

Mexico . 1,995 parts In-Stock

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UHIMA Technologies

Türkiye . 910 parts In-Stock

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Overview

Discover the cutting-edge NTMS10P02R2G by Onsemi, a top-tier manufacturer known for its superior quality and innovation in Small Signal Field Effect Transistors (FET). This P-CHANNEL transistor with a built-in diode is perfect for SWITCHING applications, offering reliability and efficiency. With a maximum drain current of 8.8A and low on-resistance, this product delivers exceptional performance. Ensure seamless operation with the NTMS10P02R2G, designed for enhanced functionality and optimal power dissipation. Elevate your projects with this high-quality transistor from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-resistance, making them ideal for applications where power efficiency is important.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and helps protect against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can efficiently control the flow of current in a circuit.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this transistor suitable for compact and automated production processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor that is easy to handle and mount on PCBs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and are easier to control, making them suitable for various applications.

Maximum Drain Current (Abs) (ID): 4.5 A

With a maximum drain current of 4.5A, this transistor can handle high current loads efficiently.

No. of Terminals: 8

The 8 terminals provide flexibility in circuit connections and allow for versatile usage in different applications.

Maximum Power Dissipation (Abs): 0.4 W

The low power dissipation of 0.4W helps in reducing heat generation and ensures the longevity of the transistor.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and densely populated circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and reliable performance in various operating conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance, reliability, and compatibility with modern electronic circuits.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and ensures a reliable electrical connection with the PCB.

Maximum Drain Current (ID): 8.8 A

Capable of handling a maximum drain current of 8.8A, this transistor is suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.014 ohm

With a low on-resistance of 0.014 ohms, this transistor efficiently conducts current while minimizing power losses.

Terminal Position: DUAL

The dual terminal position allows for easy installation and connection in various circuit configurations.

Maximum Time At Peak Reflow Temperature (s): 30

The transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during PCB assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the transistor can undergo high-temperature soldering processes without damage.

Maximum Feedback Capacitance (Crss): 1010 pF

The low feedback capacitance of 1010 pF minimizes signal distortion and ensures stable performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS10P02R2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

8.8 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1010 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS10P02R2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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