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NTJD5121NT1G

Onsemi

NTJD5121NT1G by Onsemi

NTJD5121NT1G by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, 0.295A max drain current, and 1.6 ohm max on resistance. Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C.

Median Price

$0.062

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 8,011 parts In-Stock

1+ parts

$0.222

100+ parts

$0.082

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8,011

$0.222

$0.082

$0.074

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Newark

USA . 7,961 parts In-Stock

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$0.293

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$0.120

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7,961

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DigiKey

USA . 184,908 parts In-Stock

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$0.300

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$0.114

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Mouser Electronics

USA . 142,559 parts In-Stock

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142,559

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$0.115

$0.075

$0.057

Element14

Singapore . 8,011 parts In-Stock

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$0.392

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$0.144

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8,011

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Flip Electronics (Authorized)

USA . 3,804,000 parts In-Stock

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Canada . 873,000 parts In-Stock

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Avnet

USA . 852,000 parts In-Stock

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Rochester

USA . 530,590 parts In-Stock

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Verical

USA . 321,000 parts In-Stock

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Master Electronics

USA . 159,000 parts In-Stock

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Arrow

USA . 36,000 parts In-Stock

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Chip1Stop

Japan . 14,184 parts In-Stock

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$0.060

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$0.066

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$0.036

RS (Exports)

UK . 1,560 parts In-Stock

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$0.032

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$0.089

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$0.069

1,560

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Distributors (In-Stock)

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Digiode

USA . 783 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Maritex

Poland . 3,801 parts In-Stock

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Bristol Electronics

USA . 3,494 parts In-Stock

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$0.094

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$0.037

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3,494

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$0.094

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TME

Poland . 15,197 parts In-Stock

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$0.240

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15,197

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$0.102

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$0.049

Component Electronics Inc.

Canada . 11,695 parts In-Stock

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$0.290

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Flip Electronics

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IBS Electronics

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Chip Stock

USA . 869,580 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Pegasus Components GmbH

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Component Sense

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Next Level Components, LLC

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NAC Semi

USA . 462 parts In-Stock

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Microfarads

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K-1 Technologies

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Prism Electronics

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Ampacity Inc.

Singapore . 359,359 parts In-Stock

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Semicontronic

India . 354,212 parts In-Stock

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Corohmni

South Africa . 196 parts In-Stock

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Corphita

USA . 1,179 parts In-Stock

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Argo Parts USA

USA . 124 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.073

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Continental Prestige Electronics

USA . 28,276 parts In-Stock

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$0.131

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$0.061

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$0.039

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$0.131

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$0.039

Aztec Data Supply Inc.

USA . 1,896 parts In-Stock

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$1.390

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GreenTree Electronics

Israel . 804,000 parts In-Stock

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Perfect Parts

USA . 428,016 parts In-Stock

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RC Electronics

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Glotronic Ltd.

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ChipstoGo Electronic ltd

UK . 90,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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Futuretech Components

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Lixinc

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Eastek

USA . 9,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 5,504 parts In-Stock

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Kulean Microsystems

USA . 4,602 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,356 parts In-Stock

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Problanco Electronics

Mexico . 2,155 parts In-Stock

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Latvia . 1,279 parts In-Stock

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Spain . 1,000 parts In-Stock

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Brazil . 450 parts In-Stock

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Lucentia Tech

USA . 450 parts In-Stock

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UHIMA Technologies

Türkiye . 129 parts In-Stock

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Overview

Discover the NTJD5121NT1G by Onsemi, a top-quality N-CHANNEL Small Signal Field Effect Transistor with built-in diode. Designed for switching applications, this transistor offers reliable performance and efficient power dissipation. With a minimum DS breakdown voltage of 60V and maximum drain current of 0.295A, this enhancement mode transistor is perfect for a variety of electronic projects. Trust in Onsemi's reputation for excellence and innovation when you choose the NTJD5121NT1G for your next project. Unlock the potential of your designs with this high-performance component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and thermal conductivity, making the product reliable and efficient.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and fast switching speeds, ideal for applications requiring quick responses.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in tasks that require frequent on/off transitions.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this transistor can withstand high voltage levels, making it suitable for various applications.

Maximum Drain-Source On Resistance: 1.6 ohm

Low on-resistance allows for efficient power flow through the transistor, reducing power losses and improving overall performance.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures stability and reliability even under harsh environmental conditions.

Maximum Power Dissipation (Abs): 0.266 W

The low power dissipation rating ensures minimal heat generation, enhancing the product's overall efficiency and longevity.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD5121NT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.295 A

Maximum Drain Current (ID):

.295 A

Maximum Drain-Source On Resistance:

1.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD5121NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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