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NTJD2101PT1

Onsemi

NTJD2101PT1 by Onsemi

NTJD2101PT1 by Onsemi is a P-CHANNEL FET with 2 elements and built-in diode, ideal for switching applications. It features a min DS breakdown voltage of 8V, max drain current of 0.59A, and max operating temp of 150 °C. This MOSFET has a package style of small outline, GULL WING terminals, and operates in enhancement mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,112 parts In-Stock

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Digiode

USA . 660 parts In-Stock

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660

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Problanco Electronics

Mexico . 2,971 parts In-Stock

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TANS Electronics

Latvia . 1,803 parts In-Stock

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SupplyDigital Components

Austria . 1,681 parts In-Stock

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Kulean Microsystems

USA . 1,140 parts In-Stock

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UHIMA Technologies

Türkiye . 969 parts In-Stock

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Corphita

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Corohmni

South Africa . 339 parts In-Stock

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Overview

Unleash the power of innovation with the NTJD2101PT1 by Onsemi, a game-changing Small Signal Field Effect Transistor designed for high-performance applications. Manufactured by Onsemi, this P-CHANNEL transistor offers unparalleled quality and reliability, making it the go-to choice for switching purposes. With its compact design and built-in diode, this transistor delivers exceptional efficiency and precision in every operation. Elevate your projects to new heights with the NTJD2101PT1 and experience the difference that superior technology can bring to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the transistor, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their lower resistance and higher current-carrying capability, making this FET efficient for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with 2 elements and built-in diode allows for flexible circuit design and enhanced performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and efficient operation in electronic circuits.

Surface Mount: YES

Being surface mountable, this FET is easy to mount on PCBs, saving space and providing ease of assembly in electronic devices.

Minimum DS Breakdown Voltage: 8 V

With a minimum breakdown voltage of 8V, this FET can handle higher voltages safely, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape offers convenient mounting and alignment on the circuit board, ensuring ease of integration into electronic systems.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments, ensuring reliable performance in various conditions.

Maximum Drain Current (ID): 0.59 A

The maximum drain current of 0.59A allows this FET to handle moderate current levels, making it suitable for switching applications with higher power requirements.

Maximum Drain-Source On Resistance: 0.6 ohm

The low drain-source on resistance of 0.6 ohms results in minimal power loss and heat generation, improving efficiency and reliability in switching operations.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD2101PT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (ID):

.59 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD2101PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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