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NTJD4105CT4G

Onsemi

NTJD4105CT4G by Onsemi

NTJD4105CT4G by Onsemi is a Small Signal FET with N/P-Channel, 2 elements, diode, and resistor. It operates in enhancement mode for switching applications. Features include 1.1A max drain current, 0.375 ohm RDS(on), and 150°C max temp making it ideal for various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,597 parts In-Stock

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5,597

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Digiode

USA . 900 parts In-Stock

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900

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,431 parts In-Stock

1+ parts

$1.550

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1,431

$1.550

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AZTECH Wire

Italy . 204 parts In-Stock

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$13.431

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204

$13.431

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Ampacity Inc.

Singapore . 537 parts In-Stock

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$61.050

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537

$61.050

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TANS Electronics

Latvia . 6,600 parts In-Stock

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6,600

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SupplyDigital Components

Austria . 6,014 parts In-Stock

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6,014

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Problanco Electronics

Mexico . 5,938 parts In-Stock

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5,938

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Continental Prestige Electronics

USA . 3,089 parts In-Stock

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3,089

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Corphita

USA . 2,296 parts In-Stock

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2,296

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Kulean Microsystems

USA . 1,835 parts In-Stock

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1,835

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Argo Parts USA

USA . 1,262 parts In-Stock

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1,262

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Aranea Global

USA . 500 parts In-Stock

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500

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Corohmni

South Africa . 455 parts In-Stock

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455

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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344

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Overview

Discover the NTJD4105CT4G by Onsemi, a high-quality Small Signal Field Effect Transistor designed for switching applications. With Onsemi's reputation for excellence in semiconductor manufacturing, this component offers customers reliability and performance. The NTJD4105CT4G features N-Channel and P-Channel polarity with built-in diode and resistor elements, making it a versatile choice for various electronic projects. Experience the value and benefits of this product, from its compact design to its efficient operation. Upgrade your circuits with the NTJD4105CT4G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides cost-effective and lightweight packaging for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

This FET offers the flexibility of both N-channel and P-channel types in one package, allowing for versatile circuit design and implementation.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The separate configuration with built-in diode and resistor simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed for switching applications, this FET is capable of fast turn-on and turn-off times, making it ideal for high-speed operations.

Surface Mount: YES

The surface-mount capability of this FET enables easy and convenient assembly onto PCBs, saving time and effort during manufacturing.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages, providing a margin of safety in various circuit configurations.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy integration into compact electronic devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates reliable solder connections during PCB assembly, ensuring a secure electrical connection.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode provides precise control over the FET's conductivity, allowing for efficient power management in the circuit.

No. of Elements: 2

With two elements in one package, this FET offers the convenience of a dual component solution for specific circuit requirements.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4105CT4G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.1 A

Maximum Drain Current (ID):

.63 A

Maximum Drain-Source On Resistance:

.375 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4105CT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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