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NTJD4158CT1G

Onsemi

NTJD4158CT1G by Onsemi

NTJD4158CT1G by Onsemi is a Small Signal FET with N/P-Channel, 2 elements, diode & resistor. It operates in enhancement mode for switching applications. Features include 30V breakdown voltage, 0.25A drain current, and 2.5 ohm on-resistance. Ideal for surface mount designs with a max temp of 150°C.

Median Price

$0.221

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 15 parts In-Stock

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$0.185

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DigiKey

USA . 22,585 parts In-Stock

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$0.430

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$0.168

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$0.111

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$0.081

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$0.168

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$0.081

Mouser Electronics

USA . 8,796 parts In-Stock

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$0.430

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$0.168

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$0.112

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Newark

USA . 12,479 parts In-Stock

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$0.457

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Avnet

USA . 12,000 parts In-Stock

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Verical

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Rochester

USA . 6,000 parts In-Stock

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$0.084

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$0.070

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$0.062

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$0.084

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$0.062

Farnell

UK . 5,719 parts In-Stock

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$0.189

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Element14

Singapore . 5,719 parts In-Stock

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Chip1Stop

Japan . 15 parts In-Stock

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Digiode

USA . 696 parts In-Stock

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$0.097

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Nova Conductors

Japan . 24 parts In-Stock

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Chip Stock

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A&K Electronics

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Bristol Electronics

USA . 102,000 parts In-Stock

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Rotakorn

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Vyrian

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NAC Semi

USA . 6,000 parts In-Stock

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IBS Electronics

USA . 3,000 parts In-Stock

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Rebound Electronics

UK . 1,770 parts In-Stock

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ACDS - Activité Composants Distribution Service

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LIBRA Elektronik GmbH

Germany . 217 parts In-Stock

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Sensible Micro Corp

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,626 parts In-Stock

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$0.077

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Semicontronic

India . 9,565 parts In-Stock

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$0.077

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$0.075

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9,565

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Corohmni

South Africa . 448 parts In-Stock

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$0.091

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Corphita

USA . 86 parts In-Stock

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Argo Parts USA

USA . 1,502 parts In-Stock

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Continental Prestige Electronics

USA . 568 parts In-Stock

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Aztec Data Supply Inc.

USA . 278 parts In-Stock

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Advanced Electronics

New Zealand . 54 parts In-Stock

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$1.624

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Perfect Parts

USA . 200,715 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Problanco Electronics

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Eastek

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Kulean Microsystems

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A-Z Elektronik GmbH

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SupplyDigital Components

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Glotronic Ltd.

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UHIMA Technologies

Türkiye . 537 parts In-Stock

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TANS Electronics

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Netroflash

USA . 50 parts In-Stock

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Overview

Unleash the power of innovation with the NTJD4158CT1G by Onsemi. Crafted with precision and expertise, this Small Signal Field Effect Transistor (FET) offers unrivaled performance in switching applications. With its N-CHANNEL AND P-CHANNEL polarity, separate configuration, and built-in diode and resistor elements, this transistor is a game-changer in the industry. Say goodbye to inefficiency and hello to seamless functionality with the NTJD4158CT1G. Join the ranks of satisfied customers who have experienced the value and benefits of this cutting-edge technology. Elevate your projects to new heights with Onsemi's NTJD4158CT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel options allows for versatility in circuit design and compatibility with various applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Built-in diode and resistor provide added functionality and convenience, reducing the need for additional components in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in controlling the flow of current.

Surface Mount: YES

Surface mount capability makes installation easier and allows for compact circuit design, saving space on the PCB.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this transistor can handle higher voltage applications with reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier control of the transistor and improves efficiency in switching applications.

Maximum Drain Current (ID): 0.25 A

Capable of handling a maximum drain current of 0.25 A, suitable for low to medium power applications.

Maximum Power Dissipation (Abs): 0.27 W

Low power dissipation ensures minimal heat generation and improves overall efficiency of the transistor.

Maximum Drain-Source On Resistance: 2.5 ohm

Low on-resistance leads to reduced power losses and better efficiency in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4158CT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

.25 A

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4158CT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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