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NTJD1155LT2G

Onsemi

NTJD1155LT2G by Onsemi

NTJD1155LT2G by Onsemi is a Small Signal FET with N/P-Channel, used for switching applications. It has a max drain current of 1.3A, on-resistance of 0.175Ω, and operates b/w -55°C to 150°C. Its Gull Wing terminals and compact design make it ideal for surface mount applications in various electronic devices.

Median Price

$0.279

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 165,000 parts In-Stock

1+ parts

$0.128

100+ parts

$0.120

1k+ parts

$0.109

10k+ parts

-

165,000

$0.128

$0.120

$0.109

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Mouser Electronics

USA . 1,758 parts In-Stock

1+ parts

$0.430

100+ parts

$0.180

1k+ parts

$0.106

10k+ parts

$0.071

1,758

$0.430

$0.180

$0.106

$0.071

Distributors (In-Stock)

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Digiode

USA . 994 parts In-Stock

1+ parts

$0.122

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994

$0.122

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Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$0.168

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74

$0.168

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Vyrian

USA . 93,916 parts In-Stock

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93,916

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Semtec, LLC

USA . 3,137 parts In-Stock

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3,137

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Distributors (Availability)

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Ampacity Inc.

Singapore . 93,779 parts In-Stock

1+ parts

$0.109

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-

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93,779

$0.109

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Corphita

USA . 2,275 parts In-Stock

1+ parts

$0.115

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2,275

$0.115

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Corohmni

South Africa . 117 parts In-Stock

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$0.119

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117

$0.119

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.164

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$0.158

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1,000

$0.164

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$0.158

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Continental Prestige Electronics

USA . 2,041 parts In-Stock

1+ parts

$0.168

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$0.164

2,041

$0.168

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$0.164

Argo Parts USA

USA . 1,626 parts In-Stock

1+ parts

$0.168

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$0.163

1,626

$0.168

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$0.163

Kepictronics

USA . 12,000 parts In-Stock

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12,000

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Problanco Electronics

Mexico . 3,669 parts In-Stock

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3,669

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Kulean Microsystems

USA . 2,881 parts In-Stock

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2,881

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TANS Electronics

Latvia . 1,261 parts In-Stock

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SupplyDigital Components

Austria . 498 parts In-Stock

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498

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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142

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Overview

Enhance your electronic circuits with the NTJD1155LT2G from Onsemi, a top-quality N-Channel and P-Channel Small Signal Field Effect Transistor designed for switching applications. With its complex configuration and metal-oxide semiconductor technology, this transistor offers reliable performance and efficiency. Whether you're building a new project or upgrading existing systems, this transistor delivers superior power dissipation and minimal drain-source resistance. Trust Onsemi's expertise in semiconductor manufacturing to provide you with the cutting-edge technology you need for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Offers versatility for different circuit designs and applications.

Transistor Application: SWITCHING

Suitable for applications that require fast switching speeds and low power consumption.

Minimum DS Breakdown Voltage: 8 V

Can handle higher voltage levels, making it suitable for various applications.

Surface Mount: YES

Easy to integrate into surface-mount PCB designs, saving space and reducing assembly time.

Maximum Power Dissipation (Abs): 0.4 W

Can handle moderate power levels, making it suitable for a range of applications.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, increasing reliability in harsh environments.

Maximum Drain Current (ID): 1.3 A

Capable of handling higher currents, suitable for applications that require higher power levels.

Maximum Drain-Source On Resistance: 0.175 ohm

Low on-resistance helps in minimizing power losses and improving efficiency in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD1155LT2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (ID):

1.3 A

Maximum Drain-Source On Resistance:

.175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD1155LT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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