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NTJD4152PT2G

Onsemi

NTJD4152PT2G by Onsemi

NTJD4152PT2G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, 0.88A ID, and 0.26 ohm RDS(ON). Ideal for SWITCHING applications, it features 2 elements with built-in diode and resistor in a small outline package. Operating from -55 to 150 °C, it's designed for surface mount with GULL WING terminals.

Median Price

$0.096

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 64,213 parts In-Stock

1+ parts

$0.420

100+ parts

$0.164

1k+ parts

$0.109

10k+ parts

$0.079

64,213

$0.420

$0.164

$0.109

$0.079

Mouser Electronics

USA . 6,655 parts In-Stock

1+ parts

$0.420

100+ parts

$0.164

1k+ parts

$0.109

10k+ parts

$0.070

6,655

$0.420

$0.164

$0.109

$0.070

Verical

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

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$0.060

24,000

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$0.060

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

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$0.083

3,000

-

-

-

$0.083

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

100+ parts

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$0.110

3,000

-

-

-

$0.110

Rochester

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

$0.082

1k+ parts

$0.068

10k+ parts

$0.060

2,880

-

$0.082

$0.068

$0.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.131

100+ parts

-

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50

$0.131

-

-

-

Digiode

USA . 2,487 parts In-Stock

1+ parts

$0.380

100+ parts

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2,487

$0.380

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Flip Electronics

USA . 42,000 parts In-Stock

1+ parts

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42,000

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Cyclops Electronics Ltd

UK . 16,400 parts In-Stock

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16,400

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Chip Stock

USA . 8,300 parts In-Stock

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8,300

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Vyrian

USA . 8,043 parts In-Stock

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8,043

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

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100+ parts

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$0.094

6,000

-

-

-

$0.094

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,084 parts In-Stock

1+ parts

$0.074

100+ parts

-

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8,084

$0.074

-

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Corohmni

South Africa . 376 parts In-Stock

1+ parts

$0.087

100+ parts

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376

$0.087

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Continental Prestige Electronics

USA . 4,020 parts In-Stock

1+ parts

$0.131

100+ parts

-

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10k+ parts

$0.129

4,020

$0.131

-

-

$0.129

Argo Parts USA

USA . 2,915 parts In-Stock

1+ parts

$0.131

100+ parts

-

1k+ parts

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10k+ parts

$0.127

2,915

$0.131

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-

$0.127

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.131

100+ parts

$0.129

1k+ parts

-

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100

$0.131

$0.129

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Corphita

USA . 2,136 parts In-Stock

1+ parts

$0.360

100+ parts

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2,136

$0.360

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RC Electronics

USA . 68,982 parts In-Stock

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68,982

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QUARKTWIN TECHNOLOGY LTD

USA . 24,979 parts In-Stock

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24,979

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Perfect Parts

USA . 13,406 parts In-Stock

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Lixinc

USA . 10,710 parts In-Stock

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Eastek

USA . 9,000 parts In-Stock

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$0.130

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$0.130

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Kulean Microsystems

USA . 7,859 parts In-Stock

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7,859

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TANS Electronics

Latvia . 6,998 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 5,850 parts In-Stock

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5,850

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,221 parts In-Stock

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UHIMA Technologies

Türkiye . 647 parts In-Stock

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647

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Overview

Unlock the power of small signal field effect transistors with the NTJD4152PT2G by Onsemi. Designed for switching applications, this P-channel transistor offers exceptional quality and reliability. With a package body material of PLASTIC/EPOXY and a maximum operating temperature of 150°C, this transistor is built to last. Its configuration includes two elements with a built-in diode and resistor, providing value and convenience. Trust Onsemi's expertise in semiconductor technology to deliver superior performance. Upgrade your electronic devices with the NTJD4152PT2G and experience unmatched efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this FET lightweight and durable, ideal for applications requiring portability and reliability.

Polarity or Channel Type: P-CHANNEL

The P-channel type ensures efficient operation and can be beneficial for specific circuit designs that require this type of polarity.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor in each of the two separate elements provide added functionality and can simplify circuit design.

Transistor Application: SWITCHING

This FET is designed specifically for switching applications, ensuring fast and reliable performance in such scenarios.

Surface Mount: YES

The surface-mount capability of this FET allows for easy installation on circuit boards, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact footprint, making it ideal for space-constrained applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and facilitates easy soldering during assembly.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation of this FET ensures precise control over the switching process, enhancing overall performance.

No. of Elements: 2

The FET contains two separate elements, offering versatility in circuit design and potentially reducing the need for additional components.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4152PT2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.88 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4152PT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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