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NTJD4105CT2

Onsemi

NTJD4105CT2 by Onsemi

NTJD4105CT2 by Onsemi is a Small Signal FET with N/P-Channel, 2 elements, diode & resistor. Ideal for switching applications, it has a max drain current of 1.1A, on-resistance of 0.375 ohm & operates at up to 150°C. With a package style of small outline & Gull Wing terminals, it's designed for surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 361,472 parts In-Stock

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361,472

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Vyrian

USA . 2,997 parts In-Stock

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2,997

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Digiode

USA . 1,330 parts In-Stock

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1,330

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Cyclops Electronics Ltd

UK . 1,040 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Aztec Data Supply Inc.

USA . 4,800 parts In-Stock

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$1.380

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$1.380

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AZTECH Wire

Italy . 224 parts In-Stock

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$9.804

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224

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Ampacity Inc.

Singapore . 1,279 parts In-Stock

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$54.050

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1,279

$54.050

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RC Electronics

USA . 45,000 parts In-Stock

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45,000

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Kulean Microsystems

USA . 8,326 parts In-Stock

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Problanco Electronics

Mexico . 7,727 parts In-Stock

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SupplyDigital Components

Austria . 6,425 parts In-Stock

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Continental Prestige Electronics

USA . 6,349 parts In-Stock

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TANS Electronics

Latvia . 6,131 parts In-Stock

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Argo Parts USA

USA . 2,524 parts In-Stock

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Kepictronics

USA . 1,040 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 881 parts In-Stock

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Corohmni

South Africa . 210 parts In-Stock

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UHIMA Technologies

Türkiye . 97 parts In-Stock

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97

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Overview

Enhance your electronic projects with the NTJD4105CT2 by Onsemi, a high-quality Small Signal Field Effect Transistor. Manufactured by Onsemi, this transistor offers reliable performance and versatility for switching applications. With its N-Channel and P-Channel configuration, built-in diode and resistor, and small outline package style, this transistor is designed to meet your project needs. Trust Onsemi's expertise in semiconductor technology to deliver a product that provides value, efficiency, and dependability. Upgrade your designs today with the NTJD4105CT2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various operating conditions, making the product reliable and long-lasting.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for flexibility in circuit design and application, catering to a wider range of needs.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and can potentially reduce the number of external components required, saving space and cost.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can efficiently control current flow in a circuit, making it ideal for use in various electronic devices.

Surface Mount: YES

Being surface mountable makes the product easy to install on circuit boards, saving valuable PCB space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, the transistor can handle higher voltage levels without damage, ensuring reliability in demanding applications.

Package Shape: RECTANGULAR

The rectangular shape of the package facilitates efficient PCB layout and component placement, contributing to a more compact and organized design.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control of the transistor's conductivity, providing flexibility in circuit design and ensuring optimal performance.

Maximum Drain Current (Abs) (ID): 1.1 A

With a maximum drain current of 1.1 A, this transistor can handle moderate to high current loads, making it suitable for a wide range of applications.

No. of Terminals: 6

The 6 terminals provide flexibility in connecting the transistor to other components in a circuit, enabling versatile applications and circuit configurations.

Maximum Power Dissipation (Abs): 0.55 W

The maximum power dissipation of 0.55 W indicates the transistor's ability to handle heat generated during operation, ensuring reliability under varying load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, allowing for compact and efficient designs in electronic devices with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers low power consumption, high efficiency, and fast switching speeds, making the transistor suitable for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, the transistor can perform reliably in high-temperature environments, increasing its versatility in different applications.

Transistor Element Material: SILICON

Silicon material provides good electrical properties, stability, and reliability, making the transistor suitable for long-term use in various electronic devices.

Terminal Finish: TIN LEAD

The tin-lead terminal finish offers good solderability and conductivity, facilitating easy and reliable connections during assembly and ensuring long-term performance.

Maximum Drain-Source On Resistance: 0.375 ohm

The low drain-source on resistance of 0.375 ohms minimizes power loss and heat generation in the transistor, enhancing efficiency and performance in switching applications.

Terminal Position: DUAL

The dual terminal position enables easy connection to external components, simplifying circuit design and assembly processes for improved efficiency.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235°C, the transistor can withstand high-temperature soldering processes without damage, ensuring reliable and robust connections.

Maximum Feedback Capacitance (Crss): 5 pF

The low feedback capacitance of 5 pF minimizes signal distortion and interference in high-frequency applications, ensuring stable and reliable performance in sensitive circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4105CT2 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.1 A

Maximum Drain Current (ID):

.63 A

Maximum Drain-Source On Resistance:

.375 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4105CT2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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