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NTJD4105CT1

Onsemi

NTJD4105CT1 by Onsemi

NTJD4105CT1 by Onsemi is a Small Signal FET with N/P-Channel, 2 elements, diode, and resistor. It operates in enhancement mode for switching applications. Features include 20V breakdown voltage, 0.63A drain current, 0.375 ohm on-resistance, and 150°C max temp.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Mil-Aero Solutions, Inc.

USA . 1,283 parts In-Stock

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Digiode

USA . 949 parts In-Stock

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949

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Vyrian

USA . 613 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 220 parts In-Stock

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$0.780

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220

$0.780

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AZTECH Wire

Italy . 234 parts In-Stock

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$9.534

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234

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Ampacity Inc.

Singapore . 489 parts In-Stock

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$35.050

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489

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Problanco Electronics

Mexico . 7,380 parts In-Stock

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Kulean Microsystems

USA . 5,475 parts In-Stock

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TANS Electronics

Latvia . 3,320 parts In-Stock

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Argo Parts USA

USA . 2,628 parts In-Stock

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SupplyDigital Components

Austria . 952 parts In-Stock

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Continental Prestige Electronics

USA . 917 parts In-Stock

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UHIMA Technologies

Türkiye . 750 parts In-Stock

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Futuretech Components

Singapore . 508 parts In-Stock

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Kepictronics

USA . 455 parts In-Stock

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Corphita

USA . 445 parts In-Stock

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Corohmni

South Africa . 258 parts In-Stock

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258

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock the power of efficient switching with the NTJD4105CT1 by Onsemi. Designed with precision and reliability in mind, this small signal field effect transistor offers seamless operation in a variety of applications. Whether you're looking to enhance your device's performance or streamline your processes, this product delivers exceptional value and benefits to customers. Trust in Onsemi's expertise and experience to bring you top-quality components that meet your needs with ease. Elevate your projects with the NTJD4105CT1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Allows for versatile use in a variety of circuit configurations.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Offers added functionality with built-in diode and resistor, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance.

Surface Mount: YES

Easy to mount on PCBs, saving space and facilitating automated assembly processes.

Maximum Drain Current (ID): 0.63 A

Can handle high drain currents, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 0.55 W

Has a high power dissipation capability, ensuring stable operation under load.

Maximum Drain-Source On Resistance: 0.375 ohm

Low on-resistance helps minimize power losses and improve efficiency.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, suitable for industrial and automotive applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4105CT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.63 A

Maximum Drain Current (ID):

.63 A

Maximum Drain-Source On Resistance:

.375 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4105CT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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