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BSS123L6327

Infineon Technologies

BSS123L6327 by Infineon Technologies

Infineon's BSS123L6327 is a N-CHANNEL FET with 100V DS Breakdown Voltage and 0.17A Drain Current. Ideal for small outline applications, it operates in Enhancement Mode with 6ohm On Resistance. With Matte Tin finish, it can withstand -55 to 150 °C temperatures.

Median Price

$0.088

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$0.046

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500

$0.046

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Mobius Materials

USA . 17,654 parts In-Stock

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$0.361

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$0.288

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17,654

$0.361

$0.288

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LIBRA Elektronik GmbH

Germany . 6,818 parts In-Stock

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USA . 5,152 parts In-Stock

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VNN

France . 3,034 parts In-Stock

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Martec Srl

Italy . 3,000 parts In-Stock

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J2 Sourcing AB

Sweden . 2,780 parts In-Stock

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Q Components

USA . 2,000 parts In-Stock

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Bristol Electronics

USA . 1,902 parts In-Stock

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Semi Source

USA . 973 parts In-Stock

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Tectiva GmbH

Germany . 596 parts In-Stock

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Digiode

USA . 535 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 440 parts In-Stock

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Sensible Micro Corp

USA . 329 parts In-Stock

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$0.088

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$0.081

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329

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$0.088

$0.081

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EMSNET

USA . 329 parts In-Stock

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329

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Vyrian

USA . 265 parts In-Stock

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265

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Electronics Depot

USA . 153 parts In-Stock

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Prism Electronics

USA . 72 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.045

100+ parts

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1k+ parts

$0.043

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500

$0.045

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$0.043

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Argo Parts USA

USA . 4,399 parts In-Stock

1+ parts

$0.046

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$0.045

4,399

$0.046

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$0.045

Continental Prestige Electronics

USA . 4,314 parts In-Stock

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$0.046

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$0.045

4,314

$0.046

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$0.045

Advanced Electronics

New Zealand . 200 parts In-Stock

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$0.435

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$0.413

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$0.413

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200

$0.435

$0.413

$0.413

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Corohmni

South Africa . 495 parts In-Stock

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$1.424

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495

$1.424

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Aztec Data Supply Inc.

USA . 281 parts In-Stock

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$1.460

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Modulus Dynamics

Lithuania . 16,202 parts In-Stock

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$1.912

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$1.836

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$1.759

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$1.759

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AZTECH Wire

Italy . 356 parts In-Stock

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$5.645

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Semicontronic

India . 3,268 parts In-Stock

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$47.050

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$45.874

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$45.638

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Andel Nordic

Denmark . 3,225 parts In-Stock

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$59.030

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$41.319

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$41.319

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$41.319

Ampacity Inc.

Singapore . 993 parts In-Stock

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$65.050

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Perfect Parts

USA . 914,490 parts In-Stock

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GreenTree Electronics

Israel . 108,000 parts In-Stock

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Assy Fe

Spain . 8,200 parts In-Stock

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Lixinc

USA . 3,399 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Robosynatics

Brazil . 689 parts In-Stock

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$2.220

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$2.220

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$2.220

689

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$2.220

$2.220

Metaverse IC Inc.

Canada . 300 parts In-Stock

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300

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Corphita

USA . 6 parts In-Stock

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Overview

Elevate your electronic designs with the BSS123L6327 by Infineon Technologies, a top-tier manufacturer known for producing high-quality Small Signal Field Effect Transistors (FET). This N-CHANNEL transistor, featuring a single configuration with a built-in diode, is a game-changer in the industry. Its versatility extends to various applications, offering customers unparalleled value and benefits. Experience enhanced performance and reliability with this cutting-edge product that delivers optimal results in a wide range of electronic devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the transistor, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance characteristics compared to P-channel transistors, making them a preferred choice for many circuit designs.

Minimum DS Breakdown Voltage: 100 V

A high breakdown voltage of 100V ensures reliable operation and protection against voltage spikes, making this transistor suitable for various high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and efficiency in switching applications, making this transistor ideal for use in amplifiers, power management circuits, and more.

Maximum Drain Current (ID): 0.17 A

With a maximum drain current of 0.17A, this transistor can handle moderate power levels effectively, making it suitable for low to medium power applications.

Maximum Drain-Source On Resistance: 6 ohm

A low drain-source on resistance of 6 ohms results in minimal power loss and improved efficiency in the circuit, making this transistor a good choice for high-performance applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable operation in a wide range of environmental conditions, making this transistor suitable for industrial and automotive applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123L6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

.17 A

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6.3 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

BSS123L6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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