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FDG6332C-F085P

Onsemi

FDG6332C-F085P by Onsemi

Onsemi's FDG6332C-F085P is a Small Signal FET with N/P-Channel, 2 elements w/ diode. Ideal for switching applications, it has 20V DS breakdown voltage, 0.7A max drain current, and 0.3ohm RDS(on). Operating from -55 to 150°C, this MOSFET is AEC-Q101 compliant and comes in a small outline package.

Median Price

$1.707

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$1.707

100+ parts

$1.621

1k+ parts

$1.621

10k+ parts

-

3,000

$1.707

$1.621

$1.621

-

Distributors (In-Stock)

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Digiode

USA . 215 parts In-Stock

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$1.622

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215

$1.622

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Vyrian

USA . 4,554 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,664 parts In-Stock

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$1.450

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2,664

$1.450

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Semicontronic

India . 2,589 parts In-Stock

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$1.450

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$1.414

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$1.406

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2,589

$1.450

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$1.406

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Corphita

USA . 2,392 parts In-Stock

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$1.536

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$1.536

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Aztec Data Supply Inc.

USA . 174 parts In-Stock

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$1.604

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174

$1.604

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.707

100+ parts

$1.621

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$1.621

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3,000

$1.707

$1.621

$1.621

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Corohmni

South Africa . 477 parts In-Stock

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$1.707

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477

$1.707

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AZTECH Wire

Italy . 1,123 parts In-Stock

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$9.410

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TANS Electronics

Latvia . 5,118 parts In-Stock

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Kulean Microsystems

USA . 4,640 parts In-Stock

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Problanco Electronics

Mexico . 4,414 parts In-Stock

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Argo Parts USA

USA . 3,528 parts In-Stock

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Continental Prestige Electronics

USA . 2,133 parts In-Stock

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Robosynatics

Brazil . 1,500 parts In-Stock

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$0.201

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$0.201

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$0.201

1,500

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$0.201

$0.201

$0.201

Lucentia Tech

USA . 1,500 parts In-Stock

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$0.201

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$0.201

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$0.201

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$0.201

$0.201

$0.201

SupplyDigital Components

Austria . 1,325 parts In-Stock

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UHIMA Technologies

Türkiye . 408 parts In-Stock

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408

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your electronic devices with the FDG6332C-F085P from Onsemi, a top-quality Small Signal Field Effect Transistor. Manufactured by Onsemi, known for their reliable and innovative products, this transistor offers superior performance in switching applications. With N-Channel and P-Channel configuration, this transistor provides efficiency and versatility. Its small outline package and low power dissipation make it ideal for compact designs. Trust Onsemi for cutting-edge technology that delivers value and reliability to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for versatility in circuit design, catering to different requirements.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with built-in diode enhances efficiency and performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and precise performance in controlling circuits.

Surface Mount: YES

The surface mount feature enables easy installation and space-saving design in electronic circuits.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, this transistor can handle a range of voltages, ensuring stability in operation.

Maximum Drain Current (ID): 0.7 A

Capable of handling a maximum drain current of 0.7 A, making it suitable for various applications where a higher current is required.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDG6332C-F085P attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.7 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDG6332C-F085P Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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