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FDG6301N

Onsemi

FDG6301N by Onsemi

The Onsemi FDG6301N is a N-CHANNEL FET with 2 elements and built-in diode, ideal for SWITCHING applications. It features a 25V DS Breakdown Voltage, 0.22A Drain Current, and 4 ohm On Resistance. With GULL WING terminals and SMALL OUTLINE package style, it operates in ENHANCEMENT MODE at up to 150°C.

Median Price

$0.422

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 360 parts In-Stock

1+ parts

$0.639

100+ parts

$0.205

1k+ parts

$0.158

10k+ parts

$0.135

360

$0.639

$0.205

$0.158

$0.135

Adafruit Industries

USA . 750 parts In-Stock

1+ parts

$0.736

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$0.700

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$0.700

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750

$0.736

$0.700

$0.700

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Chip1Stop

Japan . 6,000 parts In-Stock

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$0.120

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Flip Electronics (Authorized)

USA . 600 parts In-Stock

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Verical

USA . 360 parts In-Stock

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$0.205

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$0.158

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$0.135

360

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$0.158

$0.135

Distributors (In-Stock)

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Maritex

Poland . 2,898 parts In-Stock

1+ parts

$0.219

100+ parts

$0.117

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$0.111

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$0.100

2,898

$0.219

$0.117

$0.111

$0.100

TME

Poland . 273 parts In-Stock

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$0.374

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$0.239

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$0.160

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$0.148

273

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$0.148

Digiode

USA . 2,507 parts In-Stock

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$0.399

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Nova Conductors

Japan . 54 parts In-Stock

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$0.415

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Forefront Electronics and Design

USA . 25 parts In-Stock

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$1.230

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$1.230

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Cyclops Electronics Ltd

UK . 287,415 parts In-Stock

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Sensible Micro Corp

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Chip Stock

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Vyrian

USA . 27,470 parts In-Stock

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NAC Semi

USA . 15,000 parts In-Stock

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$0.208

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Kruse Electronics AG

Switzerland . 10,000 parts In-Stock

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Kruse

Germany . 10,000 parts In-Stock

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R&J Components

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NexGen Digital

USA . 5,815 parts In-Stock

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Bristol Electronics

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ComSIT Distribution GmbH

Germany . 2,980 parts In-Stock

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ComSIT USA

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Netsource Technology, Inc.

USA . 2,583 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,305 parts In-Stock

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Semi Source

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North Shore Components

USA . 1,553 parts In-Stock

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NPI Materials, Inc.

USA . 1,339 parts In-Stock

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Flip Electronics

USA . 600 parts In-Stock

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Prism Electronics

USA . 538 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 149 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 100 parts In-Stock

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Semtec, LLC

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QIE Inc.

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Distributors (Availability)

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Semicontronic

India . 27,258 parts In-Stock

1+ parts

$0.098

100+ parts

$0.096

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$0.095

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27,258

$0.098

$0.096

$0.095

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Ampacity Inc.

Singapore . 27,254 parts In-Stock

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$0.098

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Corohmni

South Africa . 488 parts In-Stock

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$0.115

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Argo Parts USA

USA . 2,648 parts In-Stock

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$0.173

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$0.168

2,648

$0.173

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Component Stockers USA

USA . 272,165 parts In-Stock

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$0.320

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$0.200

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$0.160

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$0.100

272,165

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Corphita

USA . 1,349 parts In-Stock

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$0.378

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$0.378

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Continental Prestige Electronics

USA . 7,320 parts In-Stock

1+ parts

$0.408

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$0.228

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$0.139

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7,320

$0.408

$0.228

$0.139

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Netroflash

USA . 100 parts In-Stock

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$0.415

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$0.394

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$0.386

100

$0.415

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$0.394

$0.386

Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$0.736

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$0.700

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$0.700

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750

$0.736

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$0.700

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Aztec Data Supply Inc.

USA . 5,040 parts In-Stock

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$1.521

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Eastek

USA . 165,000 parts In-Stock

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Perfect Parts

USA . 110,385 parts In-Stock

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GreenTree Electronics

Israel . 90,329 parts In-Stock

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RC Electronics

USA . 51,817 parts In-Stock

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$0.180

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$0.160

ChipstoGo Electronic ltd

UK . 35,078 parts In-Stock

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iodParts Technologies Inc.

India . 24,815 parts In-Stock

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Lixinc

USA . 9,296 parts In-Stock

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Epart123

USA . 9,000 parts In-Stock

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$2.210

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TANS Electronics

Latvia . 7,058 parts In-Stock

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Benley Electronics

USA . 6,000 parts In-Stock

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Robosynatics

Brazil . 5,355 parts In-Stock

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$1.625

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$1.592

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$1.592

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$1.592

$1.592

Lucentia Tech

USA . 5,355 parts In-Stock

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$1.625

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$1.592

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$1.592

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$1.592

SupplyDigital Components

Austria . 3,968 parts In-Stock

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Kulean Microsystems

USA . 3,934 parts In-Stock

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Kepictronics

USA . 3,152 parts In-Stock

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Authorized Procurement Solutions

USA . 2,870 parts In-Stock

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Problanco Electronics

Mexico . 2,446 parts In-Stock

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Assy Fe

Spain . 1,800 parts In-Stock

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Supply Digital

USA . 773 parts In-Stock

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S.R.D Solutions

India . 483 parts In-Stock

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UHIMA Technologies

Türkiye . 424 parts In-Stock

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Futuretech Components

Singapore . 301 parts In-Stock

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Overview

Upgrade your electronics with the FDG6301N by Onsemi! As a leading manufacturer in small signal field effect transistors, Onsemi ensures top-quality products for all your switching needs. With its N-channel configuration and built-in diode, this transistor offers enhanced performance and reliability. Whether you're working on consumer electronics, industrial applications, or automotive systems, the FDG6301N delivers exceptional value, efficiency, and power dissipation capabilities. Trust Onsemi to provide innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body offers durability and reliability, making this product suitable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have faster switching speeds and lower ON resistance compared to P-channel transistors, providing efficient performance.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The 2 separate elements with built-in diode allow for versatile circuit designs and can help in protecting the transistor from reverse voltage.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can handle rapid changes between ON and OFF states effectively.

Surface Mount: YES

The surface mount capability simplifies PCB assembly and saves space, making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 25 V

The minimum breakdown voltage of 25V ensures reliable operation under various voltage conditions, providing a margin of safety.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments without performance degradation.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDG6301N attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

.22 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDG6301N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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