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NTMS4706NR2G

Onsemi

NTMS4706NR2G by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Terminal Form: GULL WING;

Median Price

$0.267

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 272,058 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

272,058

-

$0.277

$0.230

$0.205

Verical

USA . 208,278 parts In-Stock

1+ parts

-

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$0.257

208,278

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-

-

$0.257

Distributors (In-Stock)

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Digiode

USA . 80 parts In-Stock

1+ parts

$0.217

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80

$0.217

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Vyrian

USA . 3,106 parts In-Stock

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3,106

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Cyclops Electronics Ltd

UK . 2,850 parts In-Stock

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2,850

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Rebound Electronics

UK . 2,186 parts In-Stock

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Prism Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,908 parts In-Stock

1+ parts

$0.205

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1,908

$0.205

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Corohmni

South Africa . 290 parts In-Stock

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$0.228

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290

$0.228

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$0.640

100+ parts

$0.582

1k+ parts

$0.525

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-

150

$0.640

$0.582

$0.525

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AZTECH Wire

Italy . 838 parts In-Stock

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$14.210

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838

$14.210

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Continental Prestige Electronics

USA . 269,558 parts In-Stock

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$0.209

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269,558

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Metaverse IC Inc.

Canada . 127,560 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Perfect Parts

USA . 24,384 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,056 parts In-Stock

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Assy Fe

Spain . 9,075 parts In-Stock

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TANS Electronics

Latvia . 7,085 parts In-Stock

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SupplyDigital Components

Austria . 6,357 parts In-Stock

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Kepictronics

USA . 5,169 parts In-Stock

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Kulean Microsystems

USA . 5,168 parts In-Stock

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Problanco Electronics

Mexico . 4,351 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,550 parts In-Stock

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1,550

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UHIMA Technologies

Türkiye . 848 parts In-Stock

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848

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Futuretech Components

Singapore . 505 parts In-Stock

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505

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Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS4706NR2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

6.4 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS4706NR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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