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BSS126E6327

Infineon Technologies

BSS126E6327 by Infineon Technologies

BSS126E6327 by Infineon Technologies is a N-CHANNEL FET with 600V DS breakdown voltage, 0.021A max drain current, and 500 ohm max on resistance. It is used in small signal applications requiring depletion mode operation, such as power management circuits due to its 0.5W power dissipation and compact gull wing package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 150,920 parts In-Stock

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VNN

France . 3,835 parts In-Stock

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Vyrian

USA . 2,073 parts In-Stock

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Digiode

USA . 708 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Modulus Dynamics

Lithuania . 25,777 parts In-Stock

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$1.141

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$1.095

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$1.050

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Ampacity Inc.

Singapore . 1,024 parts In-Stock

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$11.050

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AZTECH Wire

Italy . 340 parts In-Stock

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$19.484

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340

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Component Stockers USA

USA . 680 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 4,467 parts In-Stock

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Continental Prestige Electronics

USA . 4,123 parts In-Stock

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Argo Parts USA

USA . 849 parts In-Stock

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849

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Corphita

USA . 576 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the BSS126E6327 by Infineon Technologies. As a leader in the semiconductor industry, Infineon Technologies ensures top-notch quality and reliability in all their products. The BSS126E6327, belonging to the category of Small Signal Field Effect Transistors, offers exceptional performance and efficiency in a compact package. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for a wide range of applications. Trust in the value and benefits that Infineon Technologies provides with the BSS126E6327, delivering unparalleled advantages to customers seeking superior electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and protects the internal components of the transistor from external factors, making it long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and faster switching speeds, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the transistor from reverse voltage spikes, enhancing the overall reliability of the product.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage ensures that the transistor can handle high voltage applications without breakdown, making it suitable for a wide range of power circuits.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Drain Current (Abs) (ID): 0.021 A

With a maximum drain current of 0.021 A, this transistor can handle moderate power applications with efficiency.

No. of Terminals: 3

The 3 terminals provide easy connectivity and allow for versatile circuit configurations.

Maximum Power Dissipation (Abs): 0.5 W

The high power dissipation rating of 0.5 W ensures that the transistor can operate at higher power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact and efficient circuit designs.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the transistor to operate reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon material provides good conductivity and reliability, making it a common choice for high-performance transistors.

Maximum Drain-Source On Resistance: 500 ohm

The low on-resistance of 500 ohms allows for efficient power transfer and minimal power loss in the transistor.

Maximum Feedback Capacitance (Crss): 1.5 pF

The low feedback capacitance of 1.5 pF helps in reducing signal distortion and ensures stable and accurate performance of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS126E6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.021 A

Maximum Drain Current (ID):

.021 A

Maximum Drain-Source On Resistance:

500 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1.5 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS126E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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