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MMBF170LT1

Onsemi

MMBF170LT1 by Onsemi

MMBF170LT1 by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, 0.5A max drain current, and 5 ohm max on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. This small outline transistor has a peak reflow temp of 235°C and can withstand temperatures from -55 to 150°C.

Median Price

$0.801

Lifecycle Status

Suppliers In-Stock

47

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 350 parts In-Stock

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$0.801

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$0.761

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$0.761

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$0.801

$0.761

$0.761

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TEDSS.com

USA . 5,373 parts In-Stock

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Component Electronics Inc.

Canada . 2,880 parts In-Stock

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Digiode

USA . 1,875 parts In-Stock

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American Microsemiconductor Inc.

USA . 4,880 parts In-Stock

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Connector Distribution Corp

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Corohmni

South Africa . 161 parts In-Stock

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Aztec Data Supply Inc.

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Semicontronic

India . 308 parts In-Stock

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Corphita

USA . 2,443 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.801

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Ampacity Inc.

Singapore . 126 parts In-Stock

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$1.480

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Benley Electronics

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AZTECH Wire

Italy . 267 parts In-Stock

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$10.403

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Assy Fe

Spain . 28,513 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Microchip USA

USA . 15,244 parts In-Stock

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Lixinc

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Cyclops Electronics Ltd (Excess)

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Latvia . 7,103 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,848 parts In-Stock

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Mexico . 6,367 parts In-Stock

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Austria . 5,699 parts In-Stock

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Israel . 3,540 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

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Lithuania . 750 parts In-Stock

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Brazil . 250 parts In-Stock

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Overview

Unleash the power of innovation with the MMBF170LT1 by Onsemi, a top-notch Small Signal Field Effect Transistor that sets new standards in performance and reliability. With its cutting-edge technology and meticulous craftsmanship, Onsemi delivers a product that exceeds expectations in switching applications. This N-CHANNEL transistor with a built-in diode offers unparalleled efficiency and durability, making it the ideal choice for your projects. Elevate your designs with the MMBF170LT1 and experience the quality and value that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance in switching applications where an N-channel transistor is required.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, facilitating efficient manufacturing processes.

Minimum DS Breakdown Voltage: 60 V

Provides a high breakdown voltage, making the transistor suitable for applications requiring voltage protection.

Package Shape: RECTANGULAR

Enables compact and space-efficient PCB layouts when multiple transistors are used in a circuit.

Terminal Form: GULL WING

Facilitates easy soldering onto the PCB, ensuring secure connections for reliable performance.

Operating Mode: ENHANCEMENT MODE

Enhances control over the transistor's conductivity, enabling precise switching characteristics.

Maximum Drain Current (Abs) (ID): 0.5 A

Can handle moderate current levels, suitable for low to medium power switching applications.

No. of Terminals: 3

Simplifies circuit connections and reduces complexity in design with a minimal number of terminals.

Maximum Power Dissipation (Abs): 0.225 W

Efficiently dissipates heat generated during operation, ensuring reliable performance within specified limits.

Package Style (Meter): SMALL OUTLINE

Occupies minimal space on the PCB, ideal for compact electronic devices and designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for improved performance, reliability, and efficiency in switching applications.

Maximum Operating Temperature: 150 °C

Can operate effectively under high-temperature conditions without compromising performance or reliability.

Transistor Element Material: SILICON

Offers superior electrical properties and reliability compared to other materials, ensuring long-term performance.

Minimum Operating Temperature: -55 °C

Can withstand low-temperature environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides corrosion resistance and good solderability for stable electrical connections over time.

Maximum Drain-Source On Resistance: 5 ohm

Offers low resistance for efficient current flow and minimal power loss in switching applications.

Terminal Position: DUAL

Facilitates easy connections in various circuit layouts, offering versatility in design and installation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly processes, maintaining the integrity of the connections.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures, ensuring proper soldering without damaging the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMBF170LT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.5 A

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMBF170LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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