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MMBF170LT3G

Onsemi

MMBF170LT3G by Onsemi

MMBF170LT3G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.5A Drain Current, and 5 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. This PLASTIC/EPOXY package features GULL WING terminals and a built-in DIODE.

Median Price

$0.345

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 600 parts In-Stock

1+ parts

$0.637

100+ parts

$0.605

1k+ parts

$0.605

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-

600

$0.637

$0.605

$0.605

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Rochester

USA . 3,493 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

3,493

-

$0.053

$0.044

$0.039

Distributors (In-Stock)

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Digiode

USA . 547 parts In-Stock

1+ parts

$0.041

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547

$0.041

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Chip Stock

USA . 110,620 parts In-Stock

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110,620

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Vyrian

USA . 6,780 parts In-Stock

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6,780

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Nova Conductors

Japan . 800 parts In-Stock

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800

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Bristol Electronics

USA . 750 parts In-Stock

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$0.142

1k+ parts

$0.086

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750

-

$0.142

$0.086

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,632 parts In-Stock

1+ parts

$0.037

100+ parts

$0.036

1k+ parts

$0.036

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1,632

$0.037

$0.036

$0.036

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Corphita

USA . 2,072 parts In-Stock

1+ parts

$0.039

100+ parts

-

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2,072

$0.039

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Corohmni

South Africa . 50 parts In-Stock

1+ parts

$0.043

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-

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50

$0.043

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Ampacity Inc.

Singapore . 1,630 parts In-Stock

1+ parts

$0.080

100+ parts

-

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1,630

$0.080

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.637

100+ parts

$0.605

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$0.605

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600

$0.637

$0.605

$0.605

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Aztec Data Supply Inc.

USA . 1,840 parts In-Stock

1+ parts

$1.554

100+ parts

-

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1,840

$1.554

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AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$12.940

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765

$12.940

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Kepictronics

USA . 42,000 parts In-Stock

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Metaverse IC Inc.

Canada . 42,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,233 parts In-Stock

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Problanco Electronics

Mexico . 7,353 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,944 parts In-Stock

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6,944

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TANS Electronics

Latvia . 5,263 parts In-Stock

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Argo Parts USA

USA . 2,566 parts In-Stock

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SupplyDigital Components

Austria . 1,217 parts In-Stock

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UHIMA Technologies

Türkiye . 684 parts In-Stock

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Modulus Dynamics

Lithuania . 600 parts In-Stock

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600

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Continental Prestige Electronics

USA . 274 parts In-Stock

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Kulean Microsystems

USA . 68 parts In-Stock

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Bastille Electronics

Australia . 36 parts In-Stock

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Robosynatics

Brazil . 10 parts In-Stock

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$9.770

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$9.770

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$9.770

10

-

$9.770

$9.770

$9.770

Lucentia Tech

USA . 10 parts In-Stock

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$9.770

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$9.770

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$9.770

10

-

$9.770

$9.770

$9.770

Overview

Enhance your electronic devices with the MMBF170LT3G by Onsemi, a high-quality Small Signal Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is perfect for switching applications and comes in a convenient surface mount package. With a minimum DS breakdown voltage of 60V and a maximum drain current of 0.5A, this transistor delivers superior functionality while maximizing efficiency. Upgrade your circuits today with the MMBF170LT3G and experience the benefits of reliable performance and quality engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel type is commonly used for switching applications, making this transistor versatile.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and allows for more efficient switching operations.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 60 V

High breakdown voltage ensures the transistor can handle varying voltage levels without damage.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides precise control over the transistor's conductivity.

Maximum Drain Current (ID): 0.5 A

Able to handle a maximum drain current of 0.5 A, making it suitable for low to medium power applications.

Maximum Power Dissipation (Abs): 0.225 W

Low power dissipation ensures minimal heat generation and improves overall efficiency of the circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance in small signal applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the transistor can withstand elevated heat levels in various environments.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good conductivity and ensures reliable connections.

Maximum Drain-Source On Resistance: 5 ohm

Low drain-source on resistance minimizes power loss and improves the efficiency of the switching operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMBF170LT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.5 A

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMBF170LT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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