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BSS126E6906

Infineon Technologies

BSS126E6906 by Infineon Technologies

BSS126E6906 by Infineon Technologies is a N-CHANNEL FET with 600V DS breakdown voltage, 0.021A max drain current, and 500 ohm max on resistance. Ideal for applications requiring small outline packages, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,258 parts In-Stock

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VNN

France . 2,667 parts In-Stock

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Digiode

USA . 773 parts In-Stock

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773

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Modulus Dynamics

Lithuania . 6,556 parts In-Stock

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$0.638

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$0.612

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$0.587

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6,556

$0.638

$0.612

$0.587

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AZTECH Wire

Italy . 671 parts In-Stock

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$5.586

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671

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Ampacity Inc.

Singapore . 1,308 parts In-Stock

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$39.050

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QUARKTWIN TECHNOLOGY LTD

USA . 5,104 parts In-Stock

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Continental Prestige Electronics

USA . 4,082 parts In-Stock

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Argo Parts USA

USA . 1,965 parts In-Stock

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Corphita

USA . 52 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Elevate your electronics with the BSS126E6906 from Infineon Technologies. As a leader in the industry, Infineon ensures top-quality small signal field effect transistors that deliver exceptional performance and reliability. With N-channel configuration and a built-in diode, this product offers versatility in various applications. Whether you're designing consumer electronics or industrial equipment, the BSS126E6906 provides value through its high power dissipation, low feedback capacitance, and minimal drain-source resistance. Trust in Infineon to bring you cutting-edge technology that meets all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel transistors, making this product a good choice for high-performance applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600V, this transistor can handle high voltage applications with ease, ensuring safety and reliability.

Maximum Drain Current (Abs) (ID): 0.021 A

The high maximum drain current of 0.021A allows for efficient power handling, making this transistor suitable for applications that require high current capabilities.

Maximum Power Dissipation (Abs): 0.5 W

With a maximum power dissipation of 0.5W, this transistor can handle power efficiently, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high performance and reliability, making this transistor a good choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this transistor can withstand high temperatures without compromising performance, making it suitable for use in challenging environments.

Maximum Feedback Capacitance (Crss): 1.5 pF

The low feedback capacitance of 1.5 pF helps minimize feedback effects and improve the stability of the circuit, making this transistor a good choice for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS126E6906 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.021 A

Maximum Drain Current (ID):

.021 A

Maximum Drain-Source On Resistance:

500 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1.5 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS126E6906 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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