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BSS159NE6327

Infineon Technologies

BSS159NE6327 by Infineon Technologies

BSS159NE6327 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.23A Drain Current, and 3.5 ohm On Resistance. Ideal for small signal applications in electronics due to its DEPLETION MODE operation and compact SMALL OUTLINE package style.

Median Price

$0.103

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$0.103

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500

$0.103

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Vyrian

USA . 11,773 parts In-Stock

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11,773

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VNN

France . 1,576 parts In-Stock

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1,576

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Digiode

USA . 547 parts In-Stock

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547

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,043 parts In-Stock

1+ parts

$0.103

100+ parts

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$0.101

6,043

$0.103

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$0.101

Argo Parts USA

USA . 4,791 parts In-Stock

1+ parts

$0.103

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$0.100

4,791

$0.103

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$0.100

Aztec Data Supply Inc.

USA . 4,647 parts In-Stock

1+ parts

$0.440

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4,647

$0.440

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Corohmni

South Africa . 285 parts In-Stock

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$1.546

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285

$1.546

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Modulus Dynamics

Lithuania . 15,735 parts In-Stock

1+ parts

$1.862

100+ parts

$1.788

1k+ parts

$1.713

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15,735

$1.862

$1.788

$1.713

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

1+ parts

$2.050

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$2.050

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AZTECH Wire

Italy . 837 parts In-Stock

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$17.098

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837

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Semicontronic

India . 683 parts In-Stock

1+ parts

$37.050

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$36.124

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$35.938

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683

$37.050

$36.124

$35.938

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Andel Nordic

Denmark . 1,202 parts In-Stock

1+ parts

$57.070

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$39.947

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$39.947

1,202

$57.070

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$39.947

$39.947

Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$0.101

1k+ parts

$0.098

10k+ parts

$0.096

2,000

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$0.101

$0.098

$0.096

Corphita

USA . 563 parts In-Stock

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563

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Microchip USA

USA . 463 parts In-Stock

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463

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Overview

Elevate your electronic designs with the BSS159NE6327 by Infineon Technologies. Crafted with precision and quality, this small signal Field Effect Transistor offers exceptional performance and reliability for a wide range of applications. Whether you're looking to enhance your circuitry in consumer electronics or industrial equipment, this N-CHANNEL FET with a built-in diode delivers superior functionality. Benefit from its high power dissipation, low on-resistance, and versatile terminal form. Trust in Infineon Technologies to provide cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency compared to P-channel FETs, making this product a preferred choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the single configuration provides added functionality and convenience for circuit design.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs, making this product ideal for compact designs.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can withstand high voltages, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration into different circuit layouts and designs.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and facilitates easy soldering during assembly.

Operating Mode: DEPLETION MODE

Operating in depletion mode allows for better control over current flow and enhanced performance in low-power applications.

Maximum Drain Current (Abs) (ID): 0.23 A

With a maximum drain current of 0.23A, this FET can handle moderate power requirements efficiently.

No. of Terminals: 3

Having 3 terminals offers flexibility in circuit connections and configurations, making this product versatile for various applications.

Maximum Power Dissipation (Abs): 0.36 W

The ability to dissipate up to 0.36W of power ensures reliable and stable performance under heavy load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs without compromising on performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of MOSFET technology provides high switching speeds and low power consumption, making this product energy-efficient.

Maximum Operating Temperature: 150 °C

Operating at temperatures up to 150°C ensures reliability and stability in high-temperature environments.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making this product a durable choice for various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good connectivity and corrosion resistance, increasing the longevity of the product.

Maximum Drain-Source On Resistance: 3.5 ohm

The low drain-source on resistance of 3.5 ohms minimizes power losses and improves efficiency in circuit applications.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit layouts and connections, making this product suitable for various designs.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FET can withstand high-temperature soldering processes without damage.

Maximum Feedback Capacitance (Crss): 5.9 pF

The low feedback capacitance of 5.9pF ensures stable and reliable high-frequency performance in signal amplification applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS159NE6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.23 A

Maximum Drain Current (ID):

.23 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5.9 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS159NE6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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