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NTMS4840NR2G

Onsemi

NTMS4840NR2G by Onsemi

NTMS4840NR2G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 5.5A ID. Ideal for SWITCHING applications, it features 0.024 ohm RDS(ON) and a built-in DIODE in a GULL WING package style.

Median Price

$0.524

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,120 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

21,120

-

$0.515

$0.428

$0.381

Verical

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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$0.534

10k+ parts

$0.476

20,000

-

-

$0.534

$0.476

Distributors (In-Stock)

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Digiode

USA . 2,392 parts In-Stock

1+ parts

$0.401

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2,392

$0.401

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Vyrian

USA . 8,703 parts In-Stock

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8,703

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Distributors (Availability)

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Corphita

USA . 112 parts In-Stock

1+ parts

$0.380

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112

$0.380

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Corohmni

South Africa . 149 parts In-Stock

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$0.422

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149

$0.422

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AZTECH Wire

Italy . 443 parts In-Stock

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$19.810

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443

$19.810

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QUARKTWIN TECHNOLOGY LTD

USA . 24,323 parts In-Stock

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24,323

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Continental Prestige Electronics

USA . 21,120 parts In-Stock

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$0.388

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21,120

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$0.388

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Kulean Microsystems

USA . 8,221 parts In-Stock

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TANS Electronics

Latvia . 6,282 parts In-Stock

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6,282

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A-Z Elektronik GmbH

Germany . 5,984 parts In-Stock

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5,984

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,538 parts In-Stock

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3,538

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SupplyDigital Components

Austria . 1,153 parts In-Stock

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UHIMA Technologies

Türkiye . 584 parts In-Stock

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584

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Metaverse IC Inc.

Canada . 534 parts In-Stock

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534

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Unlock the power of reliable performance with the NTMS4840NR2G by Onsemi. Crafted by a trusted manufacturer, this small signal field effect transistor is designed for switching applications, offering unparalleled quality and durability. With a built-in diode and N-channel configuration, this enhancement mode transistor provides maximum drain current of 5.5 A and minimum DS breakdown voltage of 30 V. Whether you're in need of efficient power management or precise control, this surface mount transistor delivers unmatched value and performance, making it an essential component for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics than P-Channel transistors, making this a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing reliable performance and efficiency.

Surface Mount: YES

Easily mountable on PCBs, saving space and allowing for automated manufacturing processes.

Minimum DS Breakdown Voltage: 30 V

Can handle higher voltages without breaking down, suitable for a wide range of applications.

Package Shape: RECTANGULAR

Compact shape for easier integration into electronic circuits.

Terminal Form: GULL WING

Gull wing terminals are ideal for surface mount applications, providing secure connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and low leakage current, improving overall performance.

No. of Terminals: 8

Provides multiple connection points for versatile circuit designs and applications.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving and lightweight applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers low power consumption and high efficiency in switching applications.

Transistor Element Material: SILICON

Silicon is a popular semiconductor material known for its reliability and performance.

Terminal Finish: Tin (Sn)

Tin finish provides a reliable and corrosion-resistant connection for long-lasting performance.

Maximum Drain Current (ID): 5.5 A

High maximum drain current allows for handling larger loads and higher power applications.

Maximum Drain-Source On Resistance: 0.024 ohm

Low on-resistance minimizes power loss and improves efficiency during operation.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit layout and connections.

Case Connection: DRAIN

Drain connection for efficient current flow and heat dissipation.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS4840NR2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

.024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS4840NR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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